Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation

par Donghua Liu, Xiaosong Chen, Yaping Yan, Zhongwei Zhang, Zhepeng Jin, Kongyang Yi, Cong Zhang, Yujie Zheng, Yao Wang, Jun Yang, Xiangfan Xu, Jie Chen, Yunhao Lu, Dapeng Wei, Andrew Thye Shen Wee, Dacheng Wei
Publié 2019