Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO&...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Qinlong Wang, Hao Wang, Caixia Zhang, Qilong Zhang, Hui Yang
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	polymer composite dielectric loss thermal conductivity stability Organic chemistry QD241-441
Acceso en línea:	https://doaj.org/article/011662bd94974b4aa5861b15c9567b39
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:011662bd94974b4aa5861b15c9567b39
record_format	dspace
spelling	oai:doaj.org-article:011662bd94974b4aa5861b15c9567b392021-11-25T18:49:18ZCore-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates10.3390/polym132240062073-4360https://doaj.org/article/011662bd94974b4aa5861b15c9567b392021-11-01T00:00:00Zhttps://www.mdpi.com/2073-4360/13/22/4006https://doaj.org/toc/2073-4360High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO<sub>2</sub> shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 <i>vol</i>%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m<sup>−1</sup>·K<sup>−1</sup>, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.Qinlong WangHao WangCaixia ZhangQilong ZhangHui YangMDPI AGarticlepolymer compositedielectric lossthermal conductivitystabilityOrganic chemistryQD241-441ENPolymers, Vol 13, Iss 4006, p 4006 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	polymer composite dielectric loss thermal conductivity stability Organic chemistry QD241-441
spellingShingle	polymer composite dielectric loss thermal conductivity stability Organic chemistry QD241-441 Qinlong Wang Hao Wang Caixia Zhang Qilong Zhang Hui Yang Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
description	High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO<sub>2</sub> shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 <i>vol</i>%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m<sup>−1</sup>·K<sup>−1</sup>, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.
format	article
author	Qinlong Wang Hao Wang Caixia Zhang Qilong Zhang Hui Yang
author_facet	Qinlong Wang Hao Wang Caixia Zhang Qilong Zhang Hui Yang
author_sort	Qinlong Wang
title	Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
title_short	Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
title_full	Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
title_fullStr	Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
title_full_unstemmed	Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
title_sort	core-shell sr<sub>2</sub>ceo<sub>4</sub>@sio<sub>2</sub> filled coc-based composites with low dielectric loss for high-frequency substrates
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/011662bd94974b4aa5861b15c9567b39
work_keys_str_mv	AT qinlongwang coreshellsrsub2subceosub4subsiosub2subfilledcocbasedcompositeswithlowdielectriclossforhighfrequencysubstrates AT haowang coreshellsrsub2subceosub4subsiosub2subfilledcocbasedcompositeswithlowdielectriclossforhighfrequencysubstrates AT caixiazhang coreshellsrsub2subceosub4subsiosub2subfilledcocbasedcompositeswithlowdielectriclossforhighfrequencysubstrates AT qilongzhang coreshellsrsub2subceosub4subsiosub2subfilledcocbasedcompositeswithlowdielectriclossforhighfrequencysubstrates AT huiyang coreshellsrsub2subceosub4subsiosub2subfilledcocbasedcompositeswithlowdielectriclossforhighfrequencysubstrates
_version_	1718410629496176640

Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Ejemplares similares