Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO&...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Qinlong Wang, Hao Wang, Caixia Zhang, Qilong Zhang, Hui Yang
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
Materias:
Acceso en línea:https://doaj.org/article/011662bd94974b4aa5861b15c9567b39
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!

Ejemplares similares