Core-Shell Sr<sub>2</sub>CeO<sub>4</sub>@SiO<sub>2</sub> Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates
High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr<sub>2</sub>CeO<sub>4</sub>@SiO&...
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| Auteurs principaux: | , , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
MDPI AG
2021
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| Accès en ligne: | https://doaj.org/article/011662bd94974b4aa5861b15c9567b39 |
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