Design of 1 280×1 024 DI Multi-Functional IRFPA Readout Circuit

To meet the needs of the third generation infrared detector, a design of 1 280×1 024 pixel infrared readout circuit with large array and low power consumption is proposed. Based on the analysis of each module, low-power readout and working sequence of super array pixel unit are mainly de...

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Autor principal: Qiu Tianhui, Xia Xiaojuan, Liu Qi, Guan Yu
Formato: article
Lenguaje:ZH
Publicado: Editorial Office of Aero Weaponry 2021
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Acceso en línea:https://doaj.org/article/013726f05b5b49c78d8106f099903a6a
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