Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life evaluating precision of solder joints to make c...

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Autor principal:	Noritake HIYOSHI
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2016
Materias:	creep-fatigue electronic materials life prediction low temperature fatigue solder Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/03ff50b0c6e24567b56d88863e0e598b
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spelling	oai:doaj.org-article:03ff50b0c6e24567b56d88863e0e598b2021-11-26T06:51:31ZCreep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures2187-974510.1299/mej.16-00081https://doaj.org/article/03ff50b0c6e24567b56d88863e0e598b2016-05-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/3/3/3_16-00081/_pdf/-char/enhttps://doaj.org/toc/2187-9745This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life evaluating precision of solder joints to make clear the mechanical properties and creep-fatigue properties of solders at low temperatures. Cyclic push-pull fatigue tests with various strain waveforms were conducted at 253K and 273K to examine influence of strain rate and testing temperature on fatigue life of Sn-3.5Ag lead-free solder. Creep-fatigue lives under unsymmetrical full reversed strain waveform were smaller than that of symmetrical waveform at low temperatures. An application of five kinds of creep-fatigue life evaluation parameters for electronic materials at low temperatures was also discussed. They are Linear Damage Rule, Frequency Modified Fatigue Life, Ductility Exhaustion Model, Strain Range Partitioning method and Grain Boundary Sliding Model. Grain Boundary Sliding Model, which has been proposed as a fatigue life evaluation parameter for Pb-content solders and lead-free solders at high temperatures, was a suitable parameter for the correlation of creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Grain Boundary Sliding Model parameter predicted almost all of the experimental lifetimes within a small scatter conservatively.Noritake HIYOSHIThe Japan Society of Mechanical Engineersarticlecreep-fatigueelectronic materialslife predictionlow temperature fatiguesolderMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 3, Iss 3, Pp 16-00081-16-00081 (2016)
institution	DOAJ
collection	DOAJ
language	EN
topic	creep-fatigue electronic materials life prediction low temperature fatigue solder Mechanical engineering and machinery TJ1-1570
spellingShingle	creep-fatigue electronic materials life prediction low temperature fatigue solder Mechanical engineering and machinery TJ1-1570 Noritake HIYOSHI Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
description	This paper describes creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Since solders have lower melting temperature and electronic devices are often used at low temperature environment, it is effective for improving the fatigue life evaluating precision of solder joints to make clear the mechanical properties and creep-fatigue properties of solders at low temperatures. Cyclic push-pull fatigue tests with various strain waveforms were conducted at 253K and 273K to examine influence of strain rate and testing temperature on fatigue life of Sn-3.5Ag lead-free solder. Creep-fatigue lives under unsymmetrical full reversed strain waveform were smaller than that of symmetrical waveform at low temperatures. An application of five kinds of creep-fatigue life evaluation parameters for electronic materials at low temperatures was also discussed. They are Linear Damage Rule, Frequency Modified Fatigue Life, Ductility Exhaustion Model, Strain Range Partitioning method and Grain Boundary Sliding Model. Grain Boundary Sliding Model, which has been proposed as a fatigue life evaluation parameter for Pb-content solders and lead-free solders at high temperatures, was a suitable parameter for the correlation of creep-fatigue lives of Sn-3.5Ag lead-free solder at low temperatures. Grain Boundary Sliding Model parameter predicted almost all of the experimental lifetimes within a small scatter conservatively.
format	article
author	Noritake HIYOSHI
author_facet	Noritake HIYOSHI
author_sort	Noritake HIYOSHI
title	Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
title_short	Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
title_full	Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
title_fullStr	Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
title_full_unstemmed	Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
title_sort	creep-fatigue life evaluation of sn-3.5ag lead-free solder at low temperatures
publisher	The Japan Society of Mechanical Engineers
publishDate	2016
url	https://doaj.org/article/03ff50b0c6e24567b56d88863e0e598b
work_keys_str_mv	AT noritakehiyoshi creepfatiguelifeevaluationofsn35agleadfreesolderatlowtemperatures
_version_	1718409698025144320

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

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