Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish
Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formatio...
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| Auteurs principaux: | , , , , , , |
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| Format: | article |
| Langue: | EN |
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MDPI AG
2021
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| Accès en ligne: | https://doaj.org/article/043c4a8c2af548dba0a9ff33ca87ea1b |
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