Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish

Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formatio...

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Autores principales: Nor Akmal Fadil, Siti Zahira Yusof, Tuty Asma Abu Bakar, Habibah Ghazali, Muhamad Azizi Mat Yajid, Saliza Azlina Osman, Ali Ourdjini
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/043c4a8c2af548dba0a9ff33ca87ea1b
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