Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

Despite advances on fabrication of stretchable interconnects, realizing functional electronics with integrated solid-state technology (SST) remains a challenge. Here, the authors report a reversible Pol-Gel transition method for fabrication of liquid-metal based, chip-integrated, printed stretchable...

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Autores principales:	Pedro Alhais Lopes, Bruno C. Santos, Anibal T. de Almeida, Mahmoud Tavakoli
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/0ad1bd29cbd1493d9d30785499faff97
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spelling	oai:doaj.org-article:0ad1bd29cbd1493d9d30785499faff972021-12-02T18:49:22ZReversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing10.1038/s41467-021-25008-52041-1723https://doaj.org/article/0ad1bd29cbd1493d9d30785499faff972021-08-01T00:00:00Zhttps://doi.org/10.1038/s41467-021-25008-5https://doaj.org/toc/2041-1723Despite advances on fabrication of stretchable interconnects, realizing functional electronics with integrated solid-state technology (SST) remains a challenge. Here, the authors report a reversible Pol-Gel transition method for fabrication of liquid-metal based, chip-integrated, printed stretchable circuits.Pedro Alhais LopesBruno C. SantosAnibal T. de AlmeidaMahmoud TavakoliNature PortfolioarticleScienceQENNature Communications, Vol 12, Iss 1, Pp 1-10 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Pedro Alhais Lopes Bruno C. Santos Anibal T. de Almeida Mahmoud Tavakoli Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
description	Despite advances on fabrication of stretchable interconnects, realizing functional electronics with integrated solid-state technology (SST) remains a challenge. Here, the authors report a reversible Pol-Gel transition method for fabrication of liquid-metal based, chip-integrated, printed stretchable circuits.
format	article
author	Pedro Alhais Lopes Bruno C. Santos Anibal T. de Almeida Mahmoud Tavakoli
author_facet	Pedro Alhais Lopes Bruno C. Santos Anibal T. de Almeida Mahmoud Tavakoli
author_sort	Pedro Alhais Lopes
title	Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
title_short	Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
title_full	Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
title_fullStr	Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
title_full_unstemmed	Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
title_sort	reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/0ad1bd29cbd1493d9d30785499faff97
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Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

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