CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW
In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal...
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| Formato: | article |
| Lenguaje: | EN |
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Alma Mater Publishing House "Vasile Alecsandri" University of Bacau
2015
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| Acceso en línea: | https://doaj.org/article/0b9f0c14b52f4718808945d96edd8e26 |
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