Surface Topography of Si/TiO<sub>2</sub> Stacked Layers on Silicon Substrate Deposited by KrF Excimer Laser Ablation

This study investigates the surface topography of the deposited thin films versus the distance between target and substrate (<i>d<sub>TS</sub></i>) inside a laser ablation equipment. The profile of the rough surface was obtained by atomic force microscopy data analysis based...

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Autores principales: Călin Constantin Moise, Aida Pantazi, Geanina Valentina Mihai, Alin Jderu, Mircea Bercu, Angelo Alberto Messina, Marius Enăchescu
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/0e46cd79478a4414b9fa2f1cfcc779fb
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Sumario:This study investigates the surface topography of the deposited thin films versus the distance between target and substrate (<i>d<sub>TS</sub></i>) inside a laser ablation equipment. The profile of the rough surface was obtained by atomic force microscopy data analysis based on power spectral density and the roughness-length scale (RLS) functions. The roughing on the top film is analyzed considering the previous topography of the underneath surface for each consecutive TiO<sub>2</sub> and Si deposition onto Si (100) wafer. The buried oxide layer inside of Si/TiO<sub>2</sub>/c-Si structure, obtained by KrF excimer laser ablation was characterized by complementary techniques as spectral ellipsometry, X-ray reflectometry, and X-ray diffraction.