Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials

This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed, which consisted of an elastic material to rep...

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Autores principales:	Syunsuke MURAOKA, Reiichi TOKUMOTO, Yuki NAKAYAMA, Takashi TOMINAGA, Masayoshi TATENO
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2019
Materias:	ceramics stress relaxation thermal stress edge angle thermal elastoplastic analysis Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/0f008fa7bff94793a5471ebaa85568cb
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spelling	oai:doaj.org-article:0f008fa7bff94793a5471ebaa85568cb2021-11-29T05:43:34ZEffect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials2187-974510.1299/mej.18-00561https://doaj.org/article/0f008fa7bff94793a5471ebaa85568cb2019-03-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/6/3/6_18-00561/_pdf/-char/enhttps://doaj.org/toc/2187-9745This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed, which consisted of an elastic material to represent the ceramics and an elastoplastic material in the case of the metal. In this finite element method (FEM) study, it was assumed that silicon nitride and nickel were bonded at high temperatures and cooled slowly. The thermal elastoplastic behavior on the free surface of the ceramic side near the edge of the interface was determined numerically. The dependence of thermal elastoplastic behavior on geometrical interfacial configuration was also clarified numerically using FEM models with various interface edge configurations. Results of the numerical analysis were compared with the dependence of practical tensile bonding strength on the interface edge angle of a silicon nitride/nickel joints system bonded at 780°C, with the same interface shape as that of the analytical model. The practical tensile bonding strength was improved by setting the optimum interface shape. The optimum interface shape was obtained by determining the effects of the interface wedge angle on practical tensile bonding strength. Results of thermal elastoplastic analysis for the FEM model and fracture patterns suggest that an appropriate interface shape can reduce thermal residual stress near the interface edges on the ceramic side.Syunsuke MURAOKAReiichi TOKUMOTOYuki NAKAYAMATakashi TOMINAGAMasayoshi TATENOThe Japan Society of Mechanical Engineersarticleceramicsstress relaxationthermal stressedge anglethermal elastoplastic analysisMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 6, Iss 3, Pp 18-00561-18-00561 (2019)
institution	DOAJ
collection	DOAJ
language	EN
topic	ceramics stress relaxation thermal stress edge angle thermal elastoplastic analysis Mechanical engineering and machinery TJ1-1570
spellingShingle	ceramics stress relaxation thermal stress edge angle thermal elastoplastic analysis Mechanical engineering and machinery TJ1-1570 Syunsuke MURAOKA Reiichi TOKUMOTO Yuki NAKAYAMA Takashi TOMINAGA Masayoshi TATENO Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
description	This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed, which consisted of an elastic material to represent the ceramics and an elastoplastic material in the case of the metal. In this finite element method (FEM) study, it was assumed that silicon nitride and nickel were bonded at high temperatures and cooled slowly. The thermal elastoplastic behavior on the free surface of the ceramic side near the edge of the interface was determined numerically. The dependence of thermal elastoplastic behavior on geometrical interfacial configuration was also clarified numerically using FEM models with various interface edge configurations. Results of the numerical analysis were compared with the dependence of practical tensile bonding strength on the interface edge angle of a silicon nitride/nickel joints system bonded at 780°C, with the same interface shape as that of the analytical model. The practical tensile bonding strength was improved by setting the optimum interface shape. The optimum interface shape was obtained by determining the effects of the interface wedge angle on practical tensile bonding strength. Results of thermal elastoplastic analysis for the FEM model and fracture patterns suggest that an appropriate interface shape can reduce thermal residual stress near the interface edges on the ceramic side.
format	article
author	Syunsuke MURAOKA Reiichi TOKUMOTO Yuki NAKAYAMA Takashi TOMINAGA Masayoshi TATENO
author_facet	Syunsuke MURAOKA Reiichi TOKUMOTO Yuki NAKAYAMA Takashi TOMINAGA Masayoshi TATENO
author_sort	Syunsuke MURAOKA
title	Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
title_short	Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
title_full	Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
title_fullStr	Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
title_full_unstemmed	Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
title_sort	effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials
publisher	The Japan Society of Mechanical Engineers
publishDate	2019
url	https://doaj.org/article/0f008fa7bff94793a5471ebaa85568cb
work_keys_str_mv	AT syunsukemuraoka effectofinterfaceedgeangleonstressdistributionneartheinterfaceedgeofbondeddissimilarmaterials AT reiichitokumoto effectofinterfaceedgeangleonstressdistributionneartheinterfaceedgeofbondeddissimilarmaterials AT yukinakayama effectofinterfaceedgeangleonstressdistributionneartheinterfaceedgeofbondeddissimilarmaterials AT takashitominaga effectofinterfaceedgeangleonstressdistributionneartheinterfaceedgeofbondeddissimilarmaterials AT masayoshitateno effectofinterfaceedgeangleonstressdistributionneartheinterfaceedgeofbondeddissimilarmaterials
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Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials

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