Effect of Mold Heating on High-Temperature Friction and Wear Characteristics of Uncoated 22MnB5 Boron Steel

A self-developed strip-type high-temperature friction and wear test device was used to simulate the high-temperature friction process of uncoated 22MnB5 boron steel under actual hot stamping conditions. The mold was preheated to simulate the temperature increase of the die in the hot stamping proces...

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Autores principales: JIANG Yihan, WU Jiasong, WANG Wurong, WEI Xicheng
Formato: article
Lenguaje:ZH
Publicado: Editorial Office of Journal of Shanghai Jiao Tong University 2021
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Acceso en línea:https://doaj.org/article/1296ff58e85c4d0d997f8be605c46d55
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Sumario:A self-developed strip-type high-temperature friction and wear test device was used to simulate the high-temperature friction process of uncoated 22MnB5 boron steel under actual hot stamping conditions. The mold was preheated to simulate the temperature increase of the die in the hot stamping process. The effects of mold temperature on the friction behavior and mechanism of uncoated boron steel were studied by using the friction coefficient test, surface wear morphology observation, and cross-section and matrix structure chart of hot stamping boron steel. The results show that the friction coefficient between the uncoated boron steel and the H13 steel is basically stable at 0.5 when the temperature of the mold is low, and the wear mechanism is mainly classified to abrasive wear and adhesive wear. Besides, when the mold temperature exceeds 100 ℃,the friction coefficient of the uncoated boron steel decreases from 0.474 to 0.414 with an increase of temperature from 150 ℃ to 200 ℃,inferring that the adhesive wear is weakened. The Vickers hardness of the boron steel matrix is approximately close to 430 from room temperature to 100 ℃. Moreover, with the temperature further rising to 150 ℃ and 200 ℃,the hardness decreases to 413.5 and 399.7 respectively, which indicates that the mold temperature has a significant effect on the mechanical behavior of formed parts.