Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.

The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode...

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Autores principales:	Lai Chin Yung, Cheong Choke Fei, Js Mandeep, Huda Binti Abdullah, Lai Khin Wee
Formato:	article
Lenguaje:	EN
Publicado:	Public Library of Science (PLoS) 2014
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/16c3c18b9cbd47a4be562340730ba2f2
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spelling	oai:doaj.org-article:16c3c18b9cbd47a4be562340730ba2f22021-11-18T08:19:14ZSynthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.1932-620310.1371/journal.pone.0097484https://doaj.org/article/16c3c18b9cbd47a4be562340730ba2f22014-01-01T00:00:00Zhttps://www.ncbi.nlm.nih.gov/pmc/articles/pmid/24830317/pdf/?tool=EBIhttps://doaj.org/toc/1932-6203The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.Lai Chin YungCheong Choke FeiJs MandeepHuda Binti AbdullahLai Khin WeePublic Library of Science (PLoS)articleMedicineRScienceQENPLoS ONE, Vol 9, Iss 5, p e97484 (2014)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Lai Chin Yung Cheong Choke Fei Js Mandeep Huda Binti Abdullah Lai Khin Wee Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
description	The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.
format	article
author	Lai Chin Yung Cheong Choke Fei Js Mandeep Huda Binti Abdullah Lai Khin Wee
author_facet	Lai Chin Yung Cheong Choke Fei Js Mandeep Huda Binti Abdullah Lai Khin Wee
author_sort	Lai Chin Yung
title	Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
title_short	Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
title_full	Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
title_fullStr	Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
title_full_unstemmed	Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
title_sort	synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
publisher	Public Library of Science (PLoS)
publishDate	2014
url	https://doaj.org/article/16c3c18b9cbd47a4be562340730ba2f2
work_keys_str_mv	AT laichinyung synthesisofananosilvermetalinkforuseinthickconductivefilmfabricationappliedonasemiconductorpackage AT cheongchokefei synthesisofananosilvermetalinkforuseinthickconductivefilmfabricationappliedonasemiconductorpackage AT jsmandeep synthesisofananosilvermetalinkforuseinthickconductivefilmfabricationappliedonasemiconductorpackage AT hudabintiabdullah synthesisofananosilvermetalinkforuseinthickconductivefilmfabricationappliedonasemiconductorpackage AT laikhinwee synthesisofananosilvermetalinkforuseinthickconductivefilmfabricationappliedonasemiconductorpackage
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Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.

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