Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate m...

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Autores principales:	Hamed H. Saber, Ali E. Hajiah, Saleh A. Alshehri
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	self-cooling hotspot computer chips thermoelectric cooler thermoelectric generator waste heat recovery Environmental effects of industries and plants TD194-195 Renewable energy sources TJ807-830 Environmental sciences GE1-350
Acceso en línea:	https://doaj.org/article/17141038995b402b9fcdec34f502e6e2
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id	oai:doaj.org-article:17141038995b402b9fcdec34f502e6e2
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spelling	oai:doaj.org-article:17141038995b402b9fcdec34f502e6e22021-11-25T19:01:50ZSustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules10.3390/su1322125222071-1050https://doaj.org/article/17141038995b402b9fcdec34f502e6e22021-11-01T00:00:00Zhttps://www.mdpi.com/2071-1050/13/22/12522https://doaj.org/toc/2071-1050The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this study, the TEMs are used for cooling the hotspots of computer chips, and a TEC is attached to the hotspot to reduce its temperature to an acceptable value. On the other hand, the other cold surfaces of the chip are attached to TEGs for harvesting electrical power from the chip’s wasted heat. Thereafter, this harvested electrical power (HEP) is then used to run the TEC attached to the hotspot. Since no external electrical power is needed for cooling the hotspot to an acceptable temperature, this technique is called a sustainable self-cooling framework (SSCF). In this paper, the operation principles of the SSCF to cool the hotspot, subjected to different operating conditions, are discussed. As well, considerations are given to investigate the effect of the TEM geometrical parameters, such as the P-/N-leg height and spacing between the legs in both operations of the TEC mode and TEG mode on the SSCF performance.Hamed H. SaberAli E. HajiahSaleh A. AlshehriMDPI AGarticleself-coolinghotspotcomputer chipsthermoelectric coolerthermoelectric generatorwaste heat recoveryEnvironmental effects of industries and plantsTD194-195Renewable energy sourcesTJ807-830Environmental sciencesGE1-350ENSustainability, Vol 13, Iss 12522, p 12522 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	self-cooling hotspot computer chips thermoelectric cooler thermoelectric generator waste heat recovery Environmental effects of industries and plants TD194-195 Renewable energy sources TJ807-830 Environmental sciences GE1-350
spellingShingle	self-cooling hotspot computer chips thermoelectric cooler thermoelectric generator waste heat recovery Environmental effects of industries and plants TD194-195 Renewable energy sources TJ807-830 Environmental sciences GE1-350 Hamed H. Saber Ali E. Hajiah Saleh A. Alshehri Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
description	The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this study, the TEMs are used for cooling the hotspots of computer chips, and a TEC is attached to the hotspot to reduce its temperature to an acceptable value. On the other hand, the other cold surfaces of the chip are attached to TEGs for harvesting electrical power from the chip’s wasted heat. Thereafter, this harvested electrical power (HEP) is then used to run the TEC attached to the hotspot. Since no external electrical power is needed for cooling the hotspot to an acceptable temperature, this technique is called a sustainable self-cooling framework (SSCF). In this paper, the operation principles of the SSCF to cool the hotspot, subjected to different operating conditions, are discussed. As well, considerations are given to investigate the effect of the TEM geometrical parameters, such as the P-/N-leg height and spacing between the legs in both operations of the TEC mode and TEG mode on the SSCF performance.
format	article
author	Hamed H. Saber Ali E. Hajiah Saleh A. Alshehri
author_facet	Hamed H. Saber Ali E. Hajiah Saleh A. Alshehri
author_sort	Hamed H. Saber
title	Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
title_short	Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
title_full	Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
title_fullStr	Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
title_full_unstemmed	Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
title_sort	sustainable self-cooling framework for cooling computer chip hotspots using thermoelectric modules
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/17141038995b402b9fcdec34f502e6e2
work_keys_str_mv	AT hamedhsaber sustainableselfcoolingframeworkforcoolingcomputerchiphotspotsusingthermoelectricmodules AT aliehajiah sustainableselfcoolingframeworkforcoolingcomputerchiphotspotsusingthermoelectricmodules AT salehaalshehri sustainableselfcoolingframeworkforcoolingcomputerchiphotspotsusingthermoelectricmodules
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Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

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