Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate m...
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/17141038995b402b9fcdec34f502e6e2 |
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