Nanofabrication for all-soft and high-density electronic devices based on liquid metal
Though all-soft electronic devices with liquid metals are attractive due to the material’s compatibility with patterning methods, obtaining sub-micron patterns remains a challenge. Here, the authors report a hybrid lithography process to realize all-soft submicron-scale devices based on EGaIn.
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2020
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/1b66b2d62e4546fda824fa984e83f980 |
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