Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

The fatigue life of solder alloys for the slow-fast cyclic loading condition is much shorter than that for the fast-slow cyclic loading condition, despite the two loading conditions having almost the same inelastic strain amplitudes. This means that the inelastic strain amplitude is not the best par...

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Autores principales: Ken-ichi OHGUCHI, Katsuhiko SASAKI, Yuki YUZE, Kohei FUKUCHI
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Lenguaje:EN
Publicado: The Japan Society of Mechanical Engineers 2019
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Acceso en línea:https://doaj.org/article/1c36fcb075dd406195517f8baec13949
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spelling oai:doaj.org-article:1c36fcb075dd406195517f8baec139492021-11-29T05:47:04ZFatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading2187-974510.1299/mej.19-00137https://doaj.org/article/1c36fcb075dd406195517f8baec139492019-08-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/6/5/6_19-00137/_pdf/-char/enhttps://doaj.org/toc/2187-9745The fatigue life of solder alloys for the slow-fast cyclic loading condition is much shorter than that for the fast-slow cyclic loading condition, despite the two loading conditions having almost the same inelastic strain amplitudes. This means that the inelastic strain amplitude is not the best parameter used for estimating the fatigue life which shows the strain rate dependency. Then, the authors have previously proposed a fatigue life estimation method for Sn-3.0Ag-0.5Cu (SAC) solder using the creep strain amplitude obtained from the inelastic strain analysis using the stepped ramp wave (SW) loading. In this study, the fatigue tests for SAC solder under 16 loading conditions at RT and the SEM observations for the fatigue failure surfaces were conducted to give experimental supports to both the strain analysis method and the life estimation method. The inelastic strain analyses for all the tests showed that the analysis results were well correlated with the aspects of the fracture surfaces, and that the creep strain amplitudes obtained from the inelastic strain analysis were highly correlated with the strain-rate-dependent fatigue lives of SAC solder at RT. Also it was found that the relational expression between the creep strain amplitude and the fatigue life formulated at RT could be used for estimating the fatigue lives at 398 K.Ken-ichi OHGUCHIKatsuhiko SASAKIYuki YUZEKohei FUKUCHIThe Japan Society of Mechanical Engineersarticlesac solderlow-cycle fatiguestrain rate dependencyelastic-plastic-creep modelfatigue failure surfacelife estimationstepped ramp wave loadingMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 6, Iss 5, Pp 19-00137-19-00137 (2019)
institution DOAJ
collection DOAJ
language EN
topic sac solder
low-cycle fatigue
strain rate dependency
elastic-plastic-creep model
fatigue failure surface
life estimation
stepped ramp wave loading
Mechanical engineering and machinery
TJ1-1570
spellingShingle sac solder
low-cycle fatigue
strain rate dependency
elastic-plastic-creep model
fatigue failure surface
life estimation
stepped ramp wave loading
Mechanical engineering and machinery
TJ1-1570
Ken-ichi OHGUCHI
Katsuhiko SASAKI
Yuki YUZE
Kohei FUKUCHI
Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
description The fatigue life of solder alloys for the slow-fast cyclic loading condition is much shorter than that for the fast-slow cyclic loading condition, despite the two loading conditions having almost the same inelastic strain amplitudes. This means that the inelastic strain amplitude is not the best parameter used for estimating the fatigue life which shows the strain rate dependency. Then, the authors have previously proposed a fatigue life estimation method for Sn-3.0Ag-0.5Cu (SAC) solder using the creep strain amplitude obtained from the inelastic strain analysis using the stepped ramp wave (SW) loading. In this study, the fatigue tests for SAC solder under 16 loading conditions at RT and the SEM observations for the fatigue failure surfaces were conducted to give experimental supports to both the strain analysis method and the life estimation method. The inelastic strain analyses for all the tests showed that the analysis results were well correlated with the aspects of the fracture surfaces, and that the creep strain amplitudes obtained from the inelastic strain analysis were highly correlated with the strain-rate-dependent fatigue lives of SAC solder at RT. Also it was found that the relational expression between the creep strain amplitude and the fatigue life formulated at RT could be used for estimating the fatigue lives at 398 K.
format article
author Ken-ichi OHGUCHI
Katsuhiko SASAKI
Yuki YUZE
Kohei FUKUCHI
author_facet Ken-ichi OHGUCHI
Katsuhiko SASAKI
Yuki YUZE
Kohei FUKUCHI
author_sort Ken-ichi OHGUCHI
title Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
title_short Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
title_full Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
title_fullStr Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
title_full_unstemmed Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
title_sort fatigue life estimation of sac solder based on inelastic strain analysis using stepped ramp wave loading
publisher The Japan Society of Mechanical Engineers
publishDate 2019
url https://doaj.org/article/1c36fcb075dd406195517f8baec13949
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AT katsuhikosasaki fatiguelifeestimationofsacsolderbasedoninelasticstrainanalysisusingsteppedrampwaveloading
AT yukiyuze fatiguelifeestimationofsacsolderbasedoninelasticstrainanalysisusingsteppedrampwaveloading
AT koheifukuchi fatiguelifeestimationofsacsolderbasedoninelasticstrainanalysisusingsteppedrampwaveloading
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