Thermal stress analysis for a cusp-type crack problem under remote thermal loading
In this paper, the thermal stress analysis for a cusp-type crack problem under remote thermal loading is carried out. The remote thermal loading is applied at infinite place. Along the cusp-type crack, two kinds of thermal condition are assumed: (a) the thermal insulated condition, and (b) vanishing...
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Elsevier
2021
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oai:doaj.org-article:1ca80eef4b544346ae82b3b6c6f27c452021-12-01T05:05:59ZThermal stress analysis for a cusp-type crack problem under remote thermal loading2666-496810.1016/j.apples.2021.100041https://doaj.org/article/1ca80eef4b544346ae82b3b6c6f27c452021-06-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S2666496821000078https://doaj.org/toc/2666-4968In this paper, the thermal stress analysis for a cusp-type crack problem under remote thermal loading is carried out. The remote thermal loading is applied at infinite place. Along the cusp-type crack, two kinds of thermal condition are assumed: (a) the thermal insulated condition, and (b) vanishing temperature condition. The thermal temperature and the stress fields are evaluated by using the complex mapping technique and the complex potentials. It is found that the obtained stress intensity factors (SIF) are quite different for the two mentioned boundary conditions.Y.Z. ChenElsevierarticleCusp-type crackThermal stress analysisStress intensity factorClosed form solutionEngineering (General). Civil engineering (General)TA1-2040ENApplications in Engineering Science, Vol 6, Iss , Pp 100041- (2021) |
| institution |
DOAJ |
| collection |
DOAJ |
| language |
EN |
| topic |
Cusp-type crack Thermal stress analysis Stress intensity factor Closed form solution Engineering (General). Civil engineering (General) TA1-2040 |
| spellingShingle |
Cusp-type crack Thermal stress analysis Stress intensity factor Closed form solution Engineering (General). Civil engineering (General) TA1-2040 Y.Z. Chen Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| description |
In this paper, the thermal stress analysis for a cusp-type crack problem under remote thermal loading is carried out. The remote thermal loading is applied at infinite place. Along the cusp-type crack, two kinds of thermal condition are assumed: (a) the thermal insulated condition, and (b) vanishing temperature condition. The thermal temperature and the stress fields are evaluated by using the complex mapping technique and the complex potentials. It is found that the obtained stress intensity factors (SIF) are quite different for the two mentioned boundary conditions. |
| format |
article |
| author |
Y.Z. Chen |
| author_facet |
Y.Z. Chen |
| author_sort |
Y.Z. Chen |
| title |
Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| title_short |
Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| title_full |
Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| title_fullStr |
Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| title_full_unstemmed |
Thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| title_sort |
thermal stress analysis for a cusp-type crack problem under remote thermal loading |
| publisher |
Elsevier |
| publishDate |
2021 |
| url |
https://doaj.org/article/1ca80eef4b544346ae82b3b6c6f27c45 |
| work_keys_str_mv |
AT yzchen thermalstressanalysisforacusptypecrackproblemunderremotethermalloading |
| _version_ |
1718405526924034048 |