Thermal stress analysis for a cusp-type crack problem under remote thermal loading
In this paper, the thermal stress analysis for a cusp-type crack problem under remote thermal loading is carried out. The remote thermal loading is applied at infinite place. Along the cusp-type crack, two kinds of thermal condition are assumed: (a) the thermal insulated condition, and (b) vanishing...
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Elsevier
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/1ca80eef4b544346ae82b3b6c6f27c45 |
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