Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

By using the stress–impedance (SI) effect of a soft magnetic amorphous FeCuNbSiB alloy, a micromachined force sensor was fabricated and characterized. The alloy was used as a sputtered thin film of 500 nm thickness. To clarify the SI effect in the used material as a thin film, its magnetic and mecha...

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Autores principales:	Joerg Froemel, Gildas Diguet, Masanori Muroyama
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	magnetic thin film force sensing stress–impedance effect microdevice Chemical technology TP1-1185
Acceso en línea:	https://doaj.org/article/1d4174b37ff24caf94b86b80fba44b95
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spelling	oai:doaj.org-article:1d4174b37ff24caf94b86b80fba44b952021-11-25T18:57:39ZMicromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB10.3390/s212275781424-8220https://doaj.org/article/1d4174b37ff24caf94b86b80fba44b952021-11-01T00:00:00Zhttps://www.mdpi.com/1424-8220/21/22/7578https://doaj.org/toc/1424-8220By using the stress–impedance (SI) effect of a soft magnetic amorphous FeCuNbSiB alloy, a micromachined force sensor was fabricated and characterized. The alloy was used as a sputtered thin film of 500 nm thickness. To clarify the SI effect in the used material as a thin film, its magnetic and mechanical properties were first investigated. The stress dependence of the magnetic permeability was shown to be caused by the used transducer effect. The sputtered thin film also exhibited a large yield strength of 983 GPa. Even though the fabrication technology for the device is very simple, characterization revealed a gauge factor (GF) of 756, which is several times larger than that achieved with conventional transducer effects, such as the piezoresistive effect. The fabricated device shows great application potential as a tactile sensor.Joerg FroemelGildas DiguetMasanori MuroyamaMDPI AGarticlemagnetic thin filmforce sensingstress–impedance effectmicrodeviceChemical technologyTP1-1185ENSensors, Vol 21, Iss 7578, p 7578 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	magnetic thin film force sensing stress–impedance effect microdevice Chemical technology TP1-1185
spellingShingle	magnetic thin film force sensing stress–impedance effect microdevice Chemical technology TP1-1185 Joerg Froemel Gildas Diguet Masanori Muroyama Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
description	By using the stress–impedance (SI) effect of a soft magnetic amorphous FeCuNbSiB alloy, a micromachined force sensor was fabricated and characterized. The alloy was used as a sputtered thin film of 500 nm thickness. To clarify the SI effect in the used material as a thin film, its magnetic and mechanical properties were first investigated. The stress dependence of the magnetic permeability was shown to be caused by the used transducer effect. The sputtered thin film also exhibited a large yield strength of 983 GPa. Even though the fabrication technology for the device is very simple, characterization revealed a gauge factor (GF) of 756, which is several times larger than that achieved with conventional transducer effects, such as the piezoresistive effect. The fabricated device shows great application potential as a tactile sensor.
format	article
author	Joerg Froemel Gildas Diguet Masanori Muroyama
author_facet	Joerg Froemel Gildas Diguet Masanori Muroyama
author_sort	Joerg Froemel
title	Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
title_short	Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
title_full	Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
title_fullStr	Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
title_full_unstemmed	Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB
title_sort	micromechanical force sensor using the stress–impedance effect of soft magnetic fecunbsib
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/1d4174b37ff24caf94b86b80fba44b95
work_keys_str_mv	AT joergfroemel micromechanicalforcesensorusingthestressimpedanceeffectofsoftmagneticfecunbsib AT gildasdiguet micromechanicalforcesensorusingthestressimpedanceeffectofsoftmagneticfecunbsib AT masanorimuroyama micromechanicalforcesensorusingthestressimpedanceeffectofsoftmagneticfecunbsib
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Micromechanical Force Sensor Using the Stress–Impedance Effect of Soft Magnetic FeCuNbSiB

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