Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet t...

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Autores principales:	Jiri Hlina, Jan Reboun, Ales Hamacek
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	copper nickel electrical properties thick-film resistor contact resistance resistive ink Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
Acceso en línea:	https://doaj.org/article/1fe0ceb6f7bb47ce9e198d7b048db408
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spelling	oai:doaj.org-article:1fe0ceb6f7bb47ce9e198d7b048db4082021-11-25T18:15:53ZStudy of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications10.3390/ma142270391996-1944https://doaj.org/article/1fe0ceb6f7bb47ce9e198d7b048db4082021-11-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/22/7039https://doaj.org/toc/1996-1944This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 Ω/square and low temperature coefficient of resistance ±100·10<sup>−6</sup> K<sup>−1</sup> values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.Jiri HlinaJan RebounAles HamacekMDPI AGarticlecoppernickelelectrical propertiesthick-film resistorcontact resistanceresistive inkTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 7039, p 7039 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	copper nickel electrical properties thick-film resistor contact resistance resistive ink Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
spellingShingle	copper nickel electrical properties thick-film resistor contact resistance resistive ink Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Jiri Hlina Jan Reboun Ales Hamacek Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
description	This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 Ω/square and low temperature coefficient of resistance ±100·10<sup>−6</sup> K<sup>−1</sup> values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.
format	article
author	Jiri Hlina Jan Reboun Ales Hamacek
author_facet	Jiri Hlina Jan Reboun Ales Hamacek
author_sort	Jiri Hlina
title	Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
title_short	Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
title_full	Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
title_fullStr	Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
title_full_unstemmed	Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications
title_sort	study of copper-nickel nanoparticle resistive ink compatible with printed copper films for power electronics applications
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/1fe0ceb6f7bb47ce9e198d7b048db408
work_keys_str_mv	AT jirihlina studyofcoppernickelnanoparticleresistiveinkcompatiblewithprintedcopperfilmsforpowerelectronicsapplications AT janreboun studyofcoppernickelnanoparticleresistiveinkcompatiblewithprintedcopperfilmsforpowerelectronicsapplications AT aleshamacek studyofcoppernickelnanoparticleresistiveinkcompatiblewithprintedcopperfilmsforpowerelectronicsapplications
_version_	1718411368078508032

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

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