Analytical bond behavior of cold drawn SMA crimped fibers considering embedded length and fiber wave depth

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Analytical bond behavior of cold drawn SMA crimped fibers considering embedded length and fiber wave depth

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Autores principales:	Ho Ha Vinh, Choi Eunsoo, Kang Jun Won
Formato:	article
Lenguaje:	EN
Publicado:	De Gruyter 2021
Materias:	shape memory alloy crimped fiber unit pullout resistance wave depth embedded length Technology T Chemical technology TP1-1185
Acceso en línea:	https://doaj.org/article/2105cbf88a974d20ad105fdcba7dc122
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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