Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Abstract Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show tha...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Jianguo Cui, Keke Zhang, Di Zhao, Yibo Pan
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/2149788641054ae481112dcab5af1447
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:2149788641054ae481112dcab5af1447
record_format	dspace
spelling	oai:doaj.org-article:2149788641054ae481112dcab5af14472021-12-02T16:30:46ZMicrostructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling10.1038/s41598-021-85685-62045-2322https://doaj.org/article/2149788641054ae481112dcab5af14472021-03-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-85685-6https://doaj.org/toc/2045-2322Abstract Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.Jianguo CuiKeke ZhangDi ZhaoYibo PanNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-12 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Jianguo Cui Keke Zhang Di Zhao Yibo Pan Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
description	Abstract Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.
format	article
author	Jianguo Cui Keke Zhang Di Zhao Yibo Pan
author_facet	Jianguo Cui Keke Zhang Di Zhao Yibo Pan
author_sort	Jianguo Cui
title	Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
title_short	Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
title_full	Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
title_fullStr	Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
title_full_unstemmed	Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
title_sort	microstructure and shear properties of ultrasonic-assisted sn2.5ag0.7cu0.1rexni/cu solder joints under thermal cycling
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/2149788641054ae481112dcab5af1447
work_keys_str_mv	AT jianguocui microstructureandshearpropertiesofultrasonicassistedsn25ag07cu01rexnicusolderjointsunderthermalcycling AT kekezhang microstructureandshearpropertiesofultrasonicassistedsn25ag07cu01rexnicusolderjointsunderthermalcycling AT dizhao microstructureandshearpropertiesofultrasonicassistedsn25ag07cu01rexnicusolderjointsunderthermalcycling AT yibopan microstructureandshearpropertiesofultrasonicassistedsn25ag07cu01rexnicusolderjointsunderthermalcycling
_version_	1718383858692390912

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Ejemplares similares