Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
The integration of porous metal-organic frameworks into devices for electronic applications is in its infancy. Here, the authors deposit metal-organic framework films onto conductive metal plate electrodes, and show that the resulting films exhibit enhanced dielectric properties.
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| Autores principales: | , , , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2016
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/21ecec98fa5d4c39811d6d1c009fec59 |
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