Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation
The joining of aluminum using a metal of pure Sn as an interlayer or solder was investigated by reactive air soldering and vacuum diffusion bonding. The interfacial structure and mechanical property of the joints were examined. A nanometer-scale interlayer of amorphous Al2O3 dotted with nanocrystall...
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2021
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oai:doaj.org-article:250d67aff37d4333a2bba1f5e75eca942021-12-02T04:59:01ZStrengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation0264-127510.1016/j.matdes.2021.110292https://doaj.org/article/250d67aff37d4333a2bba1f5e75eca942021-12-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S0264127521008479https://doaj.org/toc/0264-1275The joining of aluminum using a metal of pure Sn as an interlayer or solder was investigated by reactive air soldering and vacuum diffusion bonding. The interfacial structure and mechanical property of the joints were examined. A nanometer-scale interlayer of amorphous Al2O3 dotted with nanocrystalline γ-Al2O3 was observed and identified at the Al/Sn interface by reactive air soldering. The shear strength of the joints (∼40 MPa) by reactive air soldering was higher than that (∼20 MPa) by vacuum diffusion bonding. The reaction and diffusion behaviors of oxygen dopants at the Al/Sn interface were studied through geometry optimization and a transition state search, respectively. The work of separation values of these two interfaces between Al/O-terminated or Sn/O-terminated was 6.46 and 2.83 J/m2, respectively, which were both larger than that of a Al/Sn interface (1.06 J/m2). The results indicated that oxygen atoms could strengthen the interfacial adhesion of Al/Sn. In addition, the interfacial reaction of Al and O and the formation process of Al2O3 were discussed. It has the potential to be used to realize a high-strength joint in other weak bonding systems such as solder/ceramics, through O doping in air.Han YanWeibing GuoTianmin LuanXinran MaGuojing XuXuesong LengWeiwei ZhaoJiuchun YanElsevierarticleReactive air solderingAl/Sn interfaceOxygen atom doppingFirst-principles calculationsStrengtheningMaterials of engineering and construction. Mechanics of materialsTA401-492ENMaterials & Design, Vol 212, Iss , Pp 110292- (2021) |
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EN |
topic |
Reactive air soldering Al/Sn interface Oxygen atom dopping First-principles calculations Strengthening Materials of engineering and construction. Mechanics of materials TA401-492 |
spellingShingle |
Reactive air soldering Al/Sn interface Oxygen atom dopping First-principles calculations Strengthening Materials of engineering and construction. Mechanics of materials TA401-492 Han Yan Weibing Guo Tianmin Luan Xinran Ma Guojing Xu Xuesong Leng Weiwei Zhao Jiuchun Yan Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
description |
The joining of aluminum using a metal of pure Sn as an interlayer or solder was investigated by reactive air soldering and vacuum diffusion bonding. The interfacial structure and mechanical property of the joints were examined. A nanometer-scale interlayer of amorphous Al2O3 dotted with nanocrystalline γ-Al2O3 was observed and identified at the Al/Sn interface by reactive air soldering. The shear strength of the joints (∼40 MPa) by reactive air soldering was higher than that (∼20 MPa) by vacuum diffusion bonding. The reaction and diffusion behaviors of oxygen dopants at the Al/Sn interface were studied through geometry optimization and a transition state search, respectively. The work of separation values of these two interfaces between Al/O-terminated or Sn/O-terminated was 6.46 and 2.83 J/m2, respectively, which were both larger than that of a Al/Sn interface (1.06 J/m2). The results indicated that oxygen atoms could strengthen the interfacial adhesion of Al/Sn. In addition, the interfacial reaction of Al and O and the formation process of Al2O3 were discussed. It has the potential to be used to realize a high-strength joint in other weak bonding systems such as solder/ceramics, through O doping in air. |
format |
article |
author |
Han Yan Weibing Guo Tianmin Luan Xinran Ma Guojing Xu Xuesong Leng Weiwei Zhao Jiuchun Yan |
author_facet |
Han Yan Weibing Guo Tianmin Luan Xinran Ma Guojing Xu Xuesong Leng Weiwei Zhao Jiuchun Yan |
author_sort |
Han Yan |
title |
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
title_short |
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
title_full |
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
title_fullStr |
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
title_full_unstemmed |
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation |
title_sort |
strengthening mechanism of al/sn interfaces: study from experiments and first-principles calculation |
publisher |
Elsevier |
publishDate |
2021 |
url |
https://doaj.org/article/250d67aff37d4333a2bba1f5e75eca94 |
work_keys_str_mv |
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