Process Parameters Optimization of Wet Shot Peening for Paint Cleaning
Wet shot peening (WSP) cleaning technology has the advantages of being green, having a high efficiency, and producing almost no pollution to the environment. Under the development trend of green environmental protection, WSP is more and more desired by the public. However, in the study of WSP cleani...
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| Autores principales: | , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/251c450c69ee43c584fc3c14c6c2ebdb |
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| Sumario: | Wet shot peening (WSP) cleaning technology has the advantages of being green, having a high efficiency, and producing almost no pollution to the environment. Under the development trend of green environmental protection, WSP is more and more desired by the public. However, in the study of WSP cleaning paint, there is little research on process parameter optimization. Accordingly, this article uses an orthogonal experiment, taking the cleaning efficiency and the substrate removal mass as objectives, to optimize the parameters of pressure, stand-off distance, traverse rate, and cleaning times. The experimental results show that the cleaning efficiency is improved by increasing the pressure, stand-off distance, and traverse rate or decreasing the cleaning times within the scope of this experiment. The pressure and cleaning times are positively correlated with the substrate removal mass, whereas the traverse rate is negatively correlated. As the stand-off distance increases, the substrate removal mass initially increases and then decreases. The traverse rate has a significant influence on the cleaning efficiency and the substrate removal mass. The optimal process parameters based on the cleaning efficiency are 0.45 MPa pressure, 140 mm stand-off distance, 5 mm/s traverse rate, and one-time cleaning. Besides, the cleaning efficiency at such conditions is 64.23 %/min. Additionally, the substrate removal mass is optimized under 0.25 MPa pressure, 60 mm (or 140 mm) stand-off distance, 5 mm/s traverse rate, and one-time cleaning to give a substrate removal mass of approximately zero. The analysis of parameters provides a reference for selecting the parameters in the actual application of WSP cleaning. |
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