Next Generation Ceramic Substrate Fabricated at Room Temperature

Abstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the nex...

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Autores principales:	Yuna Kim, Cheol-Woo Ahn, Jong-Jin Choi, Jungho Ryu, Jong-Woo Kim, Woon-Ha Yoon, Dong-Soo Park, Seog-Young Yoon, Byungjin Ma, Byung-Dong Hahn
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2017
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/267d64098a644d6c8946ea847e54558d
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id	oai:doaj.org-article:267d64098a644d6c8946ea847e54558d
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spelling	oai:doaj.org-article:267d64098a644d6c8946ea847e54558d2021-12-02T16:07:02ZNext Generation Ceramic Substrate Fabricated at Room Temperature10.1038/s41598-017-06774-z2045-2322https://doaj.org/article/267d64098a644d6c8946ea847e54558d2017-07-01T00:00:00Zhttps://doi.org/10.1038/s41598-017-06774-zhttps://doaj.org/toc/2045-2322Abstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the next generation ceramic substrate. It is fabricated by a new process [granule spray in vacuum (GSV)] which is a room temperature process. For the thin ceramic substrates, AlN GSV films are deposited on Al substrates and their electric/thermal properties are compared to those of the commercial ceramic substrates. The thermal resistance is significantly reduced by using AlN GSV films instead of AlN bulk-ceramics in thermal management systems. It is due to the removal of a thermal interface material which has low thermal conductivity. In particular, the dielectric strengths of AlN GSV films are much higher than those of AlN bulk-ceramics which are commercialized, approximately 5 times. Therefore, it can be expected that this GSV film is a next generation substrate in thermal management systems for the high power application.Yuna KimCheol-Woo AhnJong-Jin ChoiJungho RyuJong-Woo KimWoon-Ha YoonDong-Soo ParkSeog-Young YoonByungjin MaByung-Dong HahnNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 7, Iss 1, Pp 1-10 (2017)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn Next Generation Ceramic Substrate Fabricated at Room Temperature
description	Abstract A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30–70 µm) is reported for the next generation ceramic substrate. It is fabricated by a new process [granule spray in vacuum (GSV)] which is a room temperature process. For the thin ceramic substrates, AlN GSV films are deposited on Al substrates and their electric/thermal properties are compared to those of the commercial ceramic substrates. The thermal resistance is significantly reduced by using AlN GSV films instead of AlN bulk-ceramics in thermal management systems. It is due to the removal of a thermal interface material which has low thermal conductivity. In particular, the dielectric strengths of AlN GSV films are much higher than those of AlN bulk-ceramics which are commercialized, approximately 5 times. Therefore, it can be expected that this GSV film is a next generation substrate in thermal management systems for the high power application.
format	article
author	Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn
author_facet	Yuna Kim Cheol-Woo Ahn Jong-Jin Choi Jungho Ryu Jong-Woo Kim Woon-Ha Yoon Dong-Soo Park Seog-Young Yoon Byungjin Ma Byung-Dong Hahn
author_sort	Yuna Kim
title	Next Generation Ceramic Substrate Fabricated at Room Temperature
title_short	Next Generation Ceramic Substrate Fabricated at Room Temperature
title_full	Next Generation Ceramic Substrate Fabricated at Room Temperature
title_fullStr	Next Generation Ceramic Substrate Fabricated at Room Temperature
title_full_unstemmed	Next Generation Ceramic Substrate Fabricated at Room Temperature
title_sort	next generation ceramic substrate fabricated at room temperature
publisher	Nature Portfolio
publishDate	2017
url	https://doaj.org/article/267d64098a644d6c8946ea847e54558d
work_keys_str_mv	AT yunakim nextgenerationceramicsubstratefabricatedatroomtemperature AT cheolwooahn nextgenerationceramicsubstratefabricatedatroomtemperature AT jongjinchoi nextgenerationceramicsubstratefabricatedatroomtemperature AT junghoryu nextgenerationceramicsubstratefabricatedatroomtemperature AT jongwookim nextgenerationceramicsubstratefabricatedatroomtemperature AT woonhayoon nextgenerationceramicsubstratefabricatedatroomtemperature AT dongsoopark nextgenerationceramicsubstratefabricatedatroomtemperature AT seogyoungyoon nextgenerationceramicsubstratefabricatedatroomtemperature AT byungjinma nextgenerationceramicsubstratefabricatedatroomtemperature AT byungdonghahn nextgenerationceramicsubstratefabricatedatroomtemperature
_version_	1718384765865820160

Next Generation Ceramic Substrate Fabricated at Room Temperature

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