Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer

This study demonstrated the use of a thermally crosslinked polyimide (PI) for the liquid crystal (LC) alignment layer of an LC display (LCD) cell. Polyamic acid was prepared using 4,4′-oxydianiline (ODA) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA). The 6FDA−ODA-based polyimide (P...

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Autores principales: Jong-Soo Ahn, Su Hong Park, Na Yeon Kwon, Min Ju Cho, Sang-Hyon Paek, Dong Hoon Choi
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Publicado: MDPI AG 2021
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spelling oai:doaj.org-article:2681d0e60f1546c0bd15f76eb4688ed42021-11-25T18:48:10ZPhysical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer10.3390/polym132239032073-4360https://doaj.org/article/2681d0e60f1546c0bd15f76eb4688ed42021-11-01T00:00:00Zhttps://www.mdpi.com/2073-4360/13/22/3903https://doaj.org/toc/2073-4360This study demonstrated the use of a thermally crosslinked polyimide (PI) for the liquid crystal (LC) alignment layer of an LC display (LCD) cell. Polyamic acid was prepared using 4,4′-oxydianiline (ODA) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA). The 6FDA−ODA-based polyimide (PI) prepared by the thermal cyclic dehydration of the polyamic acid (PAA) was soluble in various polar solvents. After forming a thin film by mixing trifunctional epoxide [4-(oxiran-2-ylmethoxy)-N,N-bis(oxiran-2-ylmethyl)aniline] with the 6FDA−ODA-based PAA, it was confirmed that thermal curing at −110 °C caused an epoxy ring opening reaction, which could result in the formation of a networked polyimide not soluble in tetrahydrofuran. The crosslinked PI film showed a higher rigidity than the neat PI films, as measured by the elastic modulus. Furthermore, based on a dynamic mechanical analysis of the neat PI and crosslinked PI films, the glass transition temperatures (T<sub>g</sub>s) were 217 and 339 °C, respectively, which provided further evidence of the formation of crosslinking by the addition of the epoxy reagent. After mechanical rubbing using these two PI films, an LC cell was fabricated using an anisotropic PI film as an LC alignment film. LC cells with crosslinked PI layers showed a high voltage holding ratio and low residual direct current voltage. This suggests that the crosslinked PI has good potential for use as an LC alignment layer material in advanced LCD technologies that require high performance and reliability.Jong-Soo AhnSu Hong ParkNa Yeon KwonMin Ju ChoSang-Hyon PaekDong Hoon ChoiMDPI AGarticlepolyimidecrosslinkingelastic modulusliquid crystal cellvoltage holding ratioresidual direct current voltageOrganic chemistryQD241-441ENPolymers, Vol 13, Iss 3903, p 3903 (2021)
institution DOAJ
collection DOAJ
language EN
topic polyimide
crosslinking
elastic modulus
liquid crystal cell
voltage holding ratio
residual direct current voltage
Organic chemistry
QD241-441
spellingShingle polyimide
crosslinking
elastic modulus
liquid crystal cell
voltage holding ratio
residual direct current voltage
Organic chemistry
QD241-441
Jong-Soo Ahn
Su Hong Park
Na Yeon Kwon
Min Ju Cho
Sang-Hyon Paek
Dong Hoon Choi
Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
description This study demonstrated the use of a thermally crosslinked polyimide (PI) for the liquid crystal (LC) alignment layer of an LC display (LCD) cell. Polyamic acid was prepared using 4,4′-oxydianiline (ODA) and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride (6FDA). The 6FDA−ODA-based polyimide (PI) prepared by the thermal cyclic dehydration of the polyamic acid (PAA) was soluble in various polar solvents. After forming a thin film by mixing trifunctional epoxide [4-(oxiran-2-ylmethoxy)-N,N-bis(oxiran-2-ylmethyl)aniline] with the 6FDA−ODA-based PAA, it was confirmed that thermal curing at −110 °C caused an epoxy ring opening reaction, which could result in the formation of a networked polyimide not soluble in tetrahydrofuran. The crosslinked PI film showed a higher rigidity than the neat PI films, as measured by the elastic modulus. Furthermore, based on a dynamic mechanical analysis of the neat PI and crosslinked PI films, the glass transition temperatures (T<sub>g</sub>s) were 217 and 339 °C, respectively, which provided further evidence of the formation of crosslinking by the addition of the epoxy reagent. After mechanical rubbing using these two PI films, an LC cell was fabricated using an anisotropic PI film as an LC alignment film. LC cells with crosslinked PI layers showed a high voltage holding ratio and low residual direct current voltage. This suggests that the crosslinked PI has good potential for use as an LC alignment layer material in advanced LCD technologies that require high performance and reliability.
format article
author Jong-Soo Ahn
Su Hong Park
Na Yeon Kwon
Min Ju Cho
Sang-Hyon Paek
Dong Hoon Choi
author_facet Jong-Soo Ahn
Su Hong Park
Na Yeon Kwon
Min Ju Cho
Sang-Hyon Paek
Dong Hoon Choi
author_sort Jong-Soo Ahn
title Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
title_short Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
title_full Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
title_fullStr Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
title_full_unstemmed Physical Properties of Thermally Crosslinked Fluorinated Polyimide and Its Application to a Liquid Crystal Alignment Layer
title_sort physical properties of thermally crosslinked fluorinated polyimide and its application to a liquid crystal alignment layer
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/2681d0e60f1546c0bd15f76eb4688ed4
work_keys_str_mv AT jongsooahn physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
AT suhongpark physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
AT nayeonkwon physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
AT minjucho physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
AT sanghyonpaek physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
AT donghoonchoi physicalpropertiesofthermallycrosslinkedfluorinatedpolyimideanditsapplicationtoaliquidcrystalalignmentlayer
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