Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays

Abstract Several techniques have been proposed for kerfless wafering of thin Si wafers, which is one of the most essential techniques for reducing Si material loss in conventional wafering methods to lower cell cost. Proton induced exfoliation is one of promising kerfless techniques due to the simpl...

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Autores principales:	Hyeon-Seung Lee, Jaekwon Suk, Hyeyeon Kim, Joonkon Kim, Jonghan Song, Doo Seok Jeong, Jong-Keuk Park, Won Mok Kim, Doh-Kwon Lee, Kyoung Jin Choi, Byeong-Kwon Ju, Taek Sung Lee, Inho Kim
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/2df4e80b0c414f7db31c0ce7d436e071
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spelling	oai:doaj.org-article:2df4e80b0c414f7db31c0ce7d436e0712021-12-02T16:08:01ZEnhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays10.1038/s41598-018-21381-22045-2322https://doaj.org/article/2df4e80b0c414f7db31c0ce7d436e0712018-02-01T00:00:00Zhttps://doi.org/10.1038/s41598-018-21381-2https://doaj.org/toc/2045-2322Abstract Several techniques have been proposed for kerfless wafering of thin Si wafers, which is one of the most essential techniques for reducing Si material loss in conventional wafering methods to lower cell cost. Proton induced exfoliation is one of promising kerfless techniques due to the simplicity of the process of implantation and cleaving. However, for application to high efficiency solar cells, it is necessary to cope with some problems such as implantation damage removal and texturing of (111) oriented wafers. This study analyzes the end-of-range defects at both kerfless and donor wafers and ion cutting sites. Thermal treatment and isotropic etching processes allow nearly complete removal of implantation damages in the cleaved-thin wafers. Combining laser interference lithography and a reactive ion etch process, a facile nanoscale texturing process for the kerfless thin wafers of a (111) crystal orientation has been developed. We demonstrate that the introduction of nanohole array textures with an optimal design and complete damage removal lead to an improved efficiency of 15.2% based on the kerfless wafer of a 48 μm thickness using the standard architecture of the Al back surface field.Hyeon-Seung LeeJaekwon SukHyeyeon KimJoonkon KimJonghan SongDoo Seok JeongJong-Keuk ParkWon Mok KimDoh-Kwon LeeKyoung Jin ChoiByeong-Kwon JuTaek Sung LeeInho KimNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 8, Iss 1, Pp 1-12 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Hyeon-Seung Lee Jaekwon Suk Hyeyeon Kim Joonkon Kim Jonghan Song Doo Seok Jeong Jong-Keuk Park Won Mok Kim Doh-Kwon Lee Kyoung Jin Choi Byeong-Kwon Ju Taek Sung Lee Inho Kim Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
description	Abstract Several techniques have been proposed for kerfless wafering of thin Si wafers, which is one of the most essential techniques for reducing Si material loss in conventional wafering methods to lower cell cost. Proton induced exfoliation is one of promising kerfless techniques due to the simplicity of the process of implantation and cleaving. However, for application to high efficiency solar cells, it is necessary to cope with some problems such as implantation damage removal and texturing of (111) oriented wafers. This study analyzes the end-of-range defects at both kerfless and donor wafers and ion cutting sites. Thermal treatment and isotropic etching processes allow nearly complete removal of implantation damages in the cleaved-thin wafers. Combining laser interference lithography and a reactive ion etch process, a facile nanoscale texturing process for the kerfless thin wafers of a (111) crystal orientation has been developed. We demonstrate that the introduction of nanohole array textures with an optimal design and complete damage removal lead to an improved efficiency of 15.2% based on the kerfless wafer of a 48 μm thickness using the standard architecture of the Al back surface field.
format	article
author	Hyeon-Seung Lee Jaekwon Suk Hyeyeon Kim Joonkon Kim Jonghan Song Doo Seok Jeong Jong-Keuk Park Won Mok Kim Doh-Kwon Lee Kyoung Jin Choi Byeong-Kwon Ju Taek Sung Lee Inho Kim
author_facet	Hyeon-Seung Lee Jaekwon Suk Hyeyeon Kim Joonkon Kim Jonghan Song Doo Seok Jeong Jong-Keuk Park Won Mok Kim Doh-Kwon Lee Kyoung Jin Choi Byeong-Kwon Ju Taek Sung Lee Inho Kim
author_sort	Hyeon-Seung Lee
title	Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
title_short	Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
title_full	Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
title_fullStr	Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
title_full_unstemmed	Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays
title_sort	enhanced efficiency of crystalline si solar cells based on kerfless-thin wafers with nanohole arrays
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/2df4e80b0c414f7db31c0ce7d436e071
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Enhanced efficiency of crystalline Si solar cells based on kerfless-thin wafers with nanohole arrays

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