High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications

Information and communication datacentres require a large amount of energy for their cooling systems, which could be decreased by working at higher temperatures. Here, the authors introduce a silicon-polymer hybrid modulator that maintains high data rates for long periods at high temperatures that c...

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Autores principales:	Guo-Wei Lu, Jianxun Hong, Feng Qiu, Andrew M. Spring, Tsubasa Kashino, Juro Oshima, Masa-aki Ozawa, Hideyuki Nawata, Shiyoshi Yokoyama
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2020
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/30f5c0556dfb408d9020f6328c2132c1
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spelling	oai:doaj.org-article:30f5c0556dfb408d9020f6328c2132c12021-12-02T16:35:08ZHigh-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications10.1038/s41467-020-18005-72041-1723https://doaj.org/article/30f5c0556dfb408d9020f6328c2132c12020-08-01T00:00:00Zhttps://doi.org/10.1038/s41467-020-18005-7https://doaj.org/toc/2041-1723Information and communication datacentres require a large amount of energy for their cooling systems, which could be decreased by working at higher temperatures. Here, the authors introduce a silicon-polymer hybrid modulator that maintains high data rates for long periods at high temperatures that could be used under such conditions, to reduce energy consumption.Guo-Wei LuJianxun HongFeng QiuAndrew M. SpringTsubasa KashinoJuro OshimaMasa-aki OzawaHideyuki NawataShiyoshi YokoyamaNature PortfolioarticleScienceQENNature Communications, Vol 11, Iss 1, Pp 1-9 (2020)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Guo-Wei Lu Jianxun Hong Feng Qiu Andrew M. Spring Tsubasa Kashino Juro Oshima Masa-aki Ozawa Hideyuki Nawata Shiyoshi Yokoyama High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
description	Information and communication datacentres require a large amount of energy for their cooling systems, which could be decreased by working at higher temperatures. Here, the authors introduce a silicon-polymer hybrid modulator that maintains high data rates for long periods at high temperatures that could be used under such conditions, to reduce energy consumption.
format	article
author	Guo-Wei Lu Jianxun Hong Feng Qiu Andrew M. Spring Tsubasa Kashino Juro Oshima Masa-aki Ozawa Hideyuki Nawata Shiyoshi Yokoyama
author_facet	Guo-Wei Lu Jianxun Hong Feng Qiu Andrew M. Spring Tsubasa Kashino Juro Oshima Masa-aki Ozawa Hideyuki Nawata Shiyoshi Yokoyama
author_sort	Guo-Wei Lu
title	High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
title_short	High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
title_full	High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
title_fullStr	High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
title_full_unstemmed	High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications
title_sort	high-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 gbit s−1 for energy-efficient datacentres and harsh-environment applications
publisher	Nature Portfolio
publishDate	2020
url	https://doaj.org/article/30f5c0556dfb408d9020f6328c2132c1
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High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications

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