Optimization of the composition in a composite material for microelectronics application using the Ising model

Abstract Tailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these draw...

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Autores principales:	Yoshihiko Imanaka, Toshihisa Anazawa, Fumiaki Kumasaka, Hideyuki Jippo
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/345c50dba10643d2bbda6bdc137254c6
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spelling	oai:doaj.org-article:345c50dba10643d2bbda6bdc137254c62021-12-02T14:06:50ZOptimization of the composition in a composite material for microelectronics application using the Ising model10.1038/s41598-021-81243-22045-2322https://doaj.org/article/345c50dba10643d2bbda6bdc137254c62021-02-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-81243-2https://doaj.org/toc/2045-2322Abstract Tailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these drawbacks. Here, we show a new materials informatics approach applying the Ising model for solving discrete combinatorial optimization problems. In this study, the composition of the composite, aimed at developing a heat sink with three necessary properties: high thermal dissipation, attachability to Si, and a low weight, is optimized. We formulate an energy function equation concerning three objective terms with regard to the thermal conductivity, thermal expansion and specific gravity, with the composition variable and two constrained terms with a quadratic unconstrained binary optimization style equivalent to the Ising model and calculated by a simulated annealing algorithm. The composite properties of the composition selected from ten constituents are verified by the empirical mixture rule of the composite. As a result, an optimized composition with high thermal conductivity, thermal expansion close to that of Si, and a low specific gravity is acquired.Yoshihiko ImanakaToshihisa AnazawaFumiaki KumasakaHideyuki JippoNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-7 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Yoshihiko Imanaka Toshihisa Anazawa Fumiaki Kumasaka Hideyuki Jippo Optimization of the composition in a composite material for microelectronics application using the Ising model
description	Abstract Tailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these drawbacks. Here, we show a new materials informatics approach applying the Ising model for solving discrete combinatorial optimization problems. In this study, the composition of the composite, aimed at developing a heat sink with three necessary properties: high thermal dissipation, attachability to Si, and a low weight, is optimized. We formulate an energy function equation concerning three objective terms with regard to the thermal conductivity, thermal expansion and specific gravity, with the composition variable and two constrained terms with a quadratic unconstrained binary optimization style equivalent to the Ising model and calculated by a simulated annealing algorithm. The composite properties of the composition selected from ten constituents are verified by the empirical mixture rule of the composite. As a result, an optimized composition with high thermal conductivity, thermal expansion close to that of Si, and a low specific gravity is acquired.
format	article
author	Yoshihiko Imanaka Toshihisa Anazawa Fumiaki Kumasaka Hideyuki Jippo
author_facet	Yoshihiko Imanaka Toshihisa Anazawa Fumiaki Kumasaka Hideyuki Jippo
author_sort	Yoshihiko Imanaka
title	Optimization of the composition in a composite material for microelectronics application using the Ising model
title_short	Optimization of the composition in a composite material for microelectronics application using the Ising model
title_full	Optimization of the composition in a composite material for microelectronics application using the Ising model
title_fullStr	Optimization of the composition in a composite material for microelectronics application using the Ising model
title_full_unstemmed	Optimization of the composition in a composite material for microelectronics application using the Ising model
title_sort	optimization of the composition in a composite material for microelectronics application using the ising model
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/345c50dba10643d2bbda6bdc137254c6
work_keys_str_mv	AT yoshihikoimanaka optimizationofthecompositioninacompositematerialformicroelectronicsapplicationusingtheisingmodel AT toshihisaanazawa optimizationofthecompositioninacompositematerialformicroelectronicsapplicationusingtheisingmodel AT fumiakikumasaka optimizationofthecompositioninacompositematerialformicroelectronicsapplicationusingtheisingmodel AT hideyukijippo optimizationofthecompositioninacompositematerialformicroelectronicsapplicationusingtheisingmodel
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Optimization of the composition in a composite material for microelectronics application using the Ising model

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