Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid
Electrodeposition of aluminum and its alloys is of great interest in the aerospace, automobile, microelectronics, energy, recycle, and other industrial sectors, as well as for defense and, potentially, electrochemical printing applications. Here, for the first time, we report room-temperature electr...
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MDPI AG
2021
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oai:doaj.org-article:34cfac882f604ac4946f52a0ca1bca472021-11-25T17:16:58ZElectroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid10.3390/coatings111114142079-6412https://doaj.org/article/34cfac882f604ac4946f52a0ca1bca472021-11-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1414https://doaj.org/toc/2079-6412Electrodeposition of aluminum and its alloys is of great interest in the aerospace, automobile, microelectronics, energy, recycle, and other industrial sectors, as well as for defense and, potentially, electrochemical printing applications. Here, for the first time, we report room-temperature electroplating of pure aluminum on copper and nickel substrates from an ionic liquid (IL) consisting of 1-Hexyl-3-methylimidazolium (HMIm) cation and bis(trifluoromethylsulfonyl)imide (TFSI) anion, with a high concentration of 8 mol/L AlCl<sub>3</sub> aluminum precursor. The aluminum deposits are shown to have a homogeneous and dense nanocrystalline structure. A quasi-reversible reaction is monitored, where the current is affected by both charge transfer and mass transport. The electrocrystallization of Al on Ni is characterized by instantaneous nucleation. The deposited Al layers are dense, homogeneous, and of good surface coverage. They have a nanocrystalline, single-phase Al (FCC) structure, with a dislocation density typical of Al metal. An increase in the applied cathodic potential from −1.3 to −1.5 V vs. Pt resulted in more than one order of magnitude increase in the deposition rate (to ca. 44 μm per hour), as well as in ca. one order of magnitude finer grain size. The deposition rate is in accordance with typical industrial coating systems.Yarden MelamedNabasmita MaityLouisa MeshiNoam EliazMDPI AGarticleelectroplatingroom-temperature ionic liquid (RTIL)aluminumEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1414, p 1414 (2021) |
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DOAJ |
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electroplating room-temperature ionic liquid (RTIL) aluminum Engineering (General). Civil engineering (General) TA1-2040 |
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electroplating room-temperature ionic liquid (RTIL) aluminum Engineering (General). Civil engineering (General) TA1-2040 Yarden Melamed Nabasmita Maity Louisa Meshi Noam Eliaz Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| description |
Electrodeposition of aluminum and its alloys is of great interest in the aerospace, automobile, microelectronics, energy, recycle, and other industrial sectors, as well as for defense and, potentially, electrochemical printing applications. Here, for the first time, we report room-temperature electroplating of pure aluminum on copper and nickel substrates from an ionic liquid (IL) consisting of 1-Hexyl-3-methylimidazolium (HMIm) cation and bis(trifluoromethylsulfonyl)imide (TFSI) anion, with a high concentration of 8 mol/L AlCl<sub>3</sub> aluminum precursor. The aluminum deposits are shown to have a homogeneous and dense nanocrystalline structure. A quasi-reversible reaction is monitored, where the current is affected by both charge transfer and mass transport. The electrocrystallization of Al on Ni is characterized by instantaneous nucleation. The deposited Al layers are dense, homogeneous, and of good surface coverage. They have a nanocrystalline, single-phase Al (FCC) structure, with a dislocation density typical of Al metal. An increase in the applied cathodic potential from −1.3 to −1.5 V vs. Pt resulted in more than one order of magnitude increase in the deposition rate (to ca. 44 μm per hour), as well as in ca. one order of magnitude finer grain size. The deposition rate is in accordance with typical industrial coating systems. |
| format |
article |
| author |
Yarden Melamed Nabasmita Maity Louisa Meshi Noam Eliaz |
| author_facet |
Yarden Melamed Nabasmita Maity Louisa Meshi Noam Eliaz |
| author_sort |
Yarden Melamed |
| title |
Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| title_short |
Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| title_full |
Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| title_fullStr |
Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| title_full_unstemmed |
Electroplating of Pure Aluminum from [HMIm][TFSI]–AlCl<sub>3</sub> Room-Temperature Ionic Liquid |
| title_sort |
electroplating of pure aluminum from [hmim][tfsi]–alcl<sub>3</sub> room-temperature ionic liquid |
| publisher |
MDPI AG |
| publishDate |
2021 |
| url |
https://doaj.org/article/34cfac882f604ac4946f52a0ca1bca47 |
| work_keys_str_mv |
AT yardenmelamed electroplatingofpurealuminumfromhmimtfsialclsub3subroomtemperatureionicliquid AT nabasmitamaity electroplatingofpurealuminumfromhmimtfsialclsub3subroomtemperatureionicliquid AT louisameshi electroplatingofpurealuminumfromhmimtfsialclsub3subroomtemperatureionicliquid AT noameliaz electroplatingofpurealuminumfromhmimtfsialclsub3subroomtemperatureionicliquid |
| _version_ |
1718412522413883392 |