Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region

Normally-off p-GaN gated AlGaN/GaN high electron mobility transistors (HEMTs) were developed. Oxygen plasma treatment converted a low-resistive p-GaN layer in the access region to a high-resistive GaN (HR-GaN); that oxygen plasma treatment used an AlN layer as an oxygen diffusion barrier layer to pr...

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Autores principales: Xinke Liu, Hsien-Chin Chiu, Chia-Hao Liu, Hsuan-Ling Kao, Chao-Wei Chiu, Hsiang-Chun Wang, Jianwei Ben, Wei He, Chong-Rong Huang
Formato: article
Lenguaje:EN
Publicado: IEEE 2020
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Acceso en línea:https://doaj.org/article/362d5c3672b344629959f2ae3d9e6b1c
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Sumario:Normally-off p-GaN gated AlGaN/GaN high electron mobility transistors (HEMTs) were developed. Oxygen plasma treatment converted a low-resistive p-GaN layer in the access region to a high-resistive GaN (HR-GaN); that oxygen plasma treatment used an AlN layer as an oxygen diffusion barrier layer to prevent further oxidizing of the underlying AlGaN barrier layer, and to ensure that the low-resistive p-GaN layer in the access region was fully oxidized. Relative to conventional p-GaN gated AlGaN/GaN HEMTs, these AlGaN/GaN HEMTs with HR-GaN layers achieved a lower drain leakage current of 4.4 <inline-formula> <tex-math notation="LaTeX">$\times 10^{-7}$ </tex-math></inline-formula> mA/mm, a higher drain current on/off ratio of 3.9 <inline-formula> <tex-math notation="LaTeX">$\times 10^{9}$ </tex-math></inline-formula>, a lower on-state resistance of 17.1 <inline-formula> <tex-math notation="LaTeX">${\Omega }\cdot $ </tex-math></inline-formula>mm, and less current collapse.