Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region

Normally-off p-GaN gated AlGaN/GaN high electron mobility transistors (HEMTs) were developed. Oxygen plasma treatment converted a low-resistive p-GaN layer in the access region to a high-resistive GaN (HR-GaN); that oxygen plasma treatment used an AlN layer as an oxygen diffusion barrier layer to pr...

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Autores principales: Xinke Liu, Hsien-Chin Chiu, Chia-Hao Liu, Hsuan-Ling Kao, Chao-Wei Chiu, Hsiang-Chun Wang, Jianwei Ben, Wei He, Chong-Rong Huang
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Publicado: IEEE 2020
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Acceso en línea:https://doaj.org/article/362d5c3672b344629959f2ae3d9e6b1c
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spelling oai:doaj.org-article:362d5c3672b344629959f2ae3d9e6b1c2021-11-19T00:01:28ZNormally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region2168-673410.1109/JEDS.2020.2975620https://doaj.org/article/362d5c3672b344629959f2ae3d9e6b1c2020-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/9006881/https://doaj.org/toc/2168-6734Normally-off p-GaN gated AlGaN/GaN high electron mobility transistors (HEMTs) were developed. Oxygen plasma treatment converted a low-resistive p-GaN layer in the access region to a high-resistive GaN (HR-GaN); that oxygen plasma treatment used an AlN layer as an oxygen diffusion barrier layer to prevent further oxidizing of the underlying AlGaN barrier layer, and to ensure that the low-resistive p-GaN layer in the access region was fully oxidized. Relative to conventional p-GaN gated AlGaN/GaN HEMTs, these AlGaN/GaN HEMTs with HR-GaN layers achieved a lower drain leakage current of 4.4 <inline-formula> <tex-math notation="LaTeX">$\times 10^{-7}$ </tex-math></inline-formula> mA/mm, a higher drain current on/off ratio of 3.9 <inline-formula> <tex-math notation="LaTeX">$\times 10^{9}$ </tex-math></inline-formula>, a lower on-state resistance of 17.1 <inline-formula> <tex-math notation="LaTeX">${\Omega }\cdot $ </tex-math></inline-formula>mm, and less current collapse.Xinke LiuHsien-Chin ChiuChia-Hao LiuHsuan-Ling KaoChao-Wei ChiuHsiang-Chun WangJianwei BenWei HeChong-Rong HuangIEEEarticlep-GaN gate HEMTnormally-offhigh-resistivity GaNElectrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Journal of the Electron Devices Society, Vol 8, Pp 229-234 (2020)
institution DOAJ
collection DOAJ
language EN
topic p-GaN gate HEMT
normally-off
high-resistivity GaN
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
spellingShingle p-GaN gate HEMT
normally-off
high-resistivity GaN
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Xinke Liu
Hsien-Chin Chiu
Chia-Hao Liu
Hsuan-Ling Kao
Chao-Wei Chiu
Hsiang-Chun Wang
Jianwei Ben
Wei He
Chong-Rong Huang
Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
description Normally-off p-GaN gated AlGaN/GaN high electron mobility transistors (HEMTs) were developed. Oxygen plasma treatment converted a low-resistive p-GaN layer in the access region to a high-resistive GaN (HR-GaN); that oxygen plasma treatment used an AlN layer as an oxygen diffusion barrier layer to prevent further oxidizing of the underlying AlGaN barrier layer, and to ensure that the low-resistive p-GaN layer in the access region was fully oxidized. Relative to conventional p-GaN gated AlGaN/GaN HEMTs, these AlGaN/GaN HEMTs with HR-GaN layers achieved a lower drain leakage current of 4.4 <inline-formula> <tex-math notation="LaTeX">$\times 10^{-7}$ </tex-math></inline-formula> mA/mm, a higher drain current on/off ratio of 3.9 <inline-formula> <tex-math notation="LaTeX">$\times 10^{9}$ </tex-math></inline-formula>, a lower on-state resistance of 17.1 <inline-formula> <tex-math notation="LaTeX">${\Omega }\cdot $ </tex-math></inline-formula>mm, and less current collapse.
format article
author Xinke Liu
Hsien-Chin Chiu
Chia-Hao Liu
Hsuan-Ling Kao
Chao-Wei Chiu
Hsiang-Chun Wang
Jianwei Ben
Wei He
Chong-Rong Huang
author_facet Xinke Liu
Hsien-Chin Chiu
Chia-Hao Liu
Hsuan-Ling Kao
Chao-Wei Chiu
Hsiang-Chun Wang
Jianwei Ben
Wei He
Chong-Rong Huang
author_sort Xinke Liu
title Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
title_short Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
title_full Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
title_fullStr Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
title_full_unstemmed Normally-off p-GaN Gated AlGaN/GaN HEMTs Using Plasma Oxidation Technique in Access Region
title_sort normally-off p-gan gated algan/gan hemts using plasma oxidation technique in access region
publisher IEEE
publishDate 2020
url https://doaj.org/article/362d5c3672b344629959f2ae3d9e6b1c
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