Simulation and experimental characterization of microporosity during solidification in Sn-Bi alloys
The formation of microporosity during solidification of Sn-Bi alloys is investigated through experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi are solidified in a copper mould and the pore fraction is measured through scanning electron microscopy. Finite eleme...
Guardado en:
Autores principales: | Georg Siroky, Elke Kraker, Dietmar Kieslinger, Ernst Kozeschnik, Werner Ecker |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
Elsevier
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/365fafce1995480c837651cde40a13c2 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Ejemplares similares
-
Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
por: LIU Guang-zhu, et al.
Publicado: (2021) -
Strengthening mechanism of Al/Sn interfaces: Study from experiments and first-principles calculation
por: Han Yan, et al.
Publicado: (2021) -
Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
por: Noritake HIYOSHI
Publicado: (2016) -
Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder
por: Huigai Wang, et al.
Publicado: (2021) -
Experimental research on effect of opening configuration and reinforcement method on buckling and strength analyses of spar web made of composite material
por: Sen Lin, et al.
Publicado: (2021)