Electrical properties of low-temperature SiO2 thin films prepared by plasma-enhanced atomic layer deposition with different plasma times

Silicon dioxide (SiO2) thin films were prepared by plasma-enhanced atomic layer deposition (PEALD) at a low temperature of 150 °C using di-isopropylaminosilane and oxygen with different plasma times. While SiO2 films deposited with a short plasma time of 0.5 s exhibited high leakage current, SiO2 fi...

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Bibliographic Details
Main Authors: Taehyeon Kim, Changyong Oh, So Hee Park, Joo Won Lee, Sang Ik Lee, Bo Sung Kim
Format: article
Language:EN
Published: AIP Publishing LLC 2021
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Online Access:https://doaj.org/article/3a9ca9665e6e4962a7ae43f995a4b659
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