Molecular scale insights into interaction mechanisms between organic inhibitor film and copper

Abstract A model experimental approach, providing molecular scale insight into the build up mechanisms of a corrosion inhibiting interface, is reported. 2-mercaptobenzimidazole (2-MBI), a widely used organic inhibitor, was deposited from the vapor phase at ultra-low pressure on copper surfaces in ch...

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Autores principales: Xiaocui Wu, Frédéric Wiame, Vincent Maurice, Philippe Marcus
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Lenguaje:EN
Publicado: Nature Portfolio 2021
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Acceso en línea:https://doaj.org/article/433686fe6605418d9123b7301f6a80b9
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spelling oai:doaj.org-article:433686fe6605418d9123b7301f6a80b92021-12-02T17:17:40ZMolecular scale insights into interaction mechanisms between organic inhibitor film and copper10.1038/s41529-021-00168-32397-2106https://doaj.org/article/433686fe6605418d9123b7301f6a80b92021-04-01T00:00:00Zhttps://doi.org/10.1038/s41529-021-00168-3https://doaj.org/toc/2397-2106Abstract A model experimental approach, providing molecular scale insight into the build up mechanisms of a corrosion inhibiting interface, is reported. 2-mercaptobenzimidazole (2-MBI), a widely used organic inhibitor, was deposited from the vapor phase at ultra-low pressure on copper surfaces in chemically-controlled state, and X-ray photoelectron spectroscopy was used in situ to characterize the adsorption mechanisms upon formation of the inhibiting film. On copper surfaces prepared clean in the metallic state, the intact molecules lie flat at low exposure, with sulfur and both nitrogen atoms bonded to copper. A fraction of the molecules decomposes upon adsorption, leaving atomic sulfur on copper. At higher exposure, the molecules adsorb in a tilted position with sulfur and only one nitrogen bonded to copper, leading to a densification of 2-MBI in the monolayer. A bilayer is formed at saturation with the outer layer not bonded directly to copper. In the presence of a pre-adsorbed 2D oxide, oxygen is substituted and the molecules adsorb intactly without decomposition. A 3D oxide prevents the bonding of sulfur to copper. The molecular film formed on metallic and 2D oxide pre-covered surfaces partially desorbs and decomposes at temperature above 400 °C, leading to the adsorption of atomic sulfur on copper.Xiaocui WuFrédéric WiameVincent MauricePhilippe MarcusNature PortfolioarticleMaterials of engineering and construction. Mechanics of materialsTA401-492ENnpj Materials Degradation, Vol 5, Iss 1, Pp 1-8 (2021)
institution DOAJ
collection DOAJ
language EN
topic Materials of engineering and construction. Mechanics of materials
TA401-492
spellingShingle Materials of engineering and construction. Mechanics of materials
TA401-492
Xiaocui Wu
Frédéric Wiame
Vincent Maurice
Philippe Marcus
Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
description Abstract A model experimental approach, providing molecular scale insight into the build up mechanisms of a corrosion inhibiting interface, is reported. 2-mercaptobenzimidazole (2-MBI), a widely used organic inhibitor, was deposited from the vapor phase at ultra-low pressure on copper surfaces in chemically-controlled state, and X-ray photoelectron spectroscopy was used in situ to characterize the adsorption mechanisms upon formation of the inhibiting film. On copper surfaces prepared clean in the metallic state, the intact molecules lie flat at low exposure, with sulfur and both nitrogen atoms bonded to copper. A fraction of the molecules decomposes upon adsorption, leaving atomic sulfur on copper. At higher exposure, the molecules adsorb in a tilted position with sulfur and only one nitrogen bonded to copper, leading to a densification of 2-MBI in the monolayer. A bilayer is formed at saturation with the outer layer not bonded directly to copper. In the presence of a pre-adsorbed 2D oxide, oxygen is substituted and the molecules adsorb intactly without decomposition. A 3D oxide prevents the bonding of sulfur to copper. The molecular film formed on metallic and 2D oxide pre-covered surfaces partially desorbs and decomposes at temperature above 400 °C, leading to the adsorption of atomic sulfur on copper.
format article
author Xiaocui Wu
Frédéric Wiame
Vincent Maurice
Philippe Marcus
author_facet Xiaocui Wu
Frédéric Wiame
Vincent Maurice
Philippe Marcus
author_sort Xiaocui Wu
title Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
title_short Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
title_full Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
title_fullStr Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
title_full_unstemmed Molecular scale insights into interaction mechanisms between organic inhibitor film and copper
title_sort molecular scale insights into interaction mechanisms between organic inhibitor film and copper
publisher Nature Portfolio
publishDate 2021
url https://doaj.org/article/433686fe6605418d9123b7301f6a80b9
work_keys_str_mv AT xiaocuiwu molecularscaleinsightsintointeractionmechanismsbetweenorganicinhibitorfilmandcopper
AT fredericwiame molecularscaleinsightsintointeractionmechanismsbetweenorganicinhibitorfilmandcopper
AT vincentmaurice molecularscaleinsightsintointeractionmechanismsbetweenorganicinhibitorfilmandcopper
AT philippemarcus molecularscaleinsightsintointeractionmechanismsbetweenorganicinhibitorfilmandcopper
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