Copper Surface Treatment in Metal-Polymer Direct Molding Technology

The preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, t...

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Autores principales:	GUO Rongsheng, HU Guanghong, RONG Jian, WANG Yuanlong
Formato:	article
Lenguaje:	ZH
Publicado:	Editorial Office of Journal of Shanghai Jiao Tong University 2021
Materias:	copper surface treatment nano injection molding anodic oxidation micro-nano structure Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989
Acceso en línea:	https://doaj.org/article/46ddab8adea24df78147d8b740fffe01
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spelling	oai:doaj.org-article:46ddab8adea24df78147d8b740fffe012021-11-04T09:35:15ZCopper Surface Treatment in Metal-Polymer Direct Molding Technology1006-246710.16183/j.cnki.jsjtu.2019.185https://doaj.org/article/46ddab8adea24df78147d8b740fffe012021-01-01T00:00:00Zhttp://xuebao.sjtu.edu.cn/CN/10.16183/j.cnki.jsjtu.2019.185https://doaj.org/toc/1006-2467The preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, the copper surface is treated with aqueous solution containing phosphate and sodium dihydrogen phosphate as corrosion solution to obtain a micro-nano structure on the copper. The surface is observed by using a scanning electron microscope. Finally, the analysis software is used to analyze the scanning electron microscope image to calculate the micro-nano structure pores on the copper surface. The results show that when the anodizing voltage is 15 V, the anodizing time is 20 min, the phosphoric acid mass fraction is 20%, and the corrosion time is 30 min, the copper surface is relatively smooth, and the porosity reaches 25.77%. Orthogonal experiments demonstrate that the type, concentration of the corrosive solution, and etching time have a great effect, while the anodizing electrolyte, voltage and electrolysis have no significant effect on the porosity. Using a combination of anodic oxidation and chemical corrosion, micro and nano junctions with uniform and high porosity can be prepared on the copper surface.GUO RongshengHU GuanghongRONG JianWANG YuanlongEditorial Office of Journal of Shanghai Jiao Tong Universityarticlecoppersurface treatmentnano injection moldinganodic oxidationmicro-nano structureEngineering (General). Civil engineering (General)TA1-2040Chemical engineeringTP155-156Naval architecture. Shipbuilding. Marine engineeringVM1-989ZHShanghai Jiaotong Daxue xuebao, Vol 55, Iss 01, Pp 96-102 (2021)
institution	DOAJ
collection	DOAJ
language	ZH
topic	copper surface treatment nano injection molding anodic oxidation micro-nano structure Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989
spellingShingle	copper surface treatment nano injection molding anodic oxidation micro-nano structure Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989 GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong Copper Surface Treatment in Metal-Polymer Direct Molding Technology
description	The preparation technology of micro-nano structure on copper surface is studied and optimized. Aqueous solution containing sodium carbonate and sodium molybdate is used as electrolyte, and the copper sample is anodized at a constant voltage to form a layer of oxidation on the copper surface. Then, the copper surface is treated with aqueous solution containing phosphate and sodium dihydrogen phosphate as corrosion solution to obtain a micro-nano structure on the copper. The surface is observed by using a scanning electron microscope. Finally, the analysis software is used to analyze the scanning electron microscope image to calculate the micro-nano structure pores on the copper surface. The results show that when the anodizing voltage is 15 V, the anodizing time is 20 min, the phosphoric acid mass fraction is 20%, and the corrosion time is 30 min, the copper surface is relatively smooth, and the porosity reaches 25.77%. Orthogonal experiments demonstrate that the type, concentration of the corrosive solution, and etching time have a great effect, while the anodizing electrolyte, voltage and electrolysis have no significant effect on the porosity. Using a combination of anodic oxidation and chemical corrosion, micro and nano junctions with uniform and high porosity can be prepared on the copper surface.
format	article
author	GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong
author_facet	GUO Rongsheng HU Guanghong RONG Jian WANG Yuanlong
author_sort	GUO Rongsheng
title	Copper Surface Treatment in Metal-Polymer Direct Molding Technology
title_short	Copper Surface Treatment in Metal-Polymer Direct Molding Technology
title_full	Copper Surface Treatment in Metal-Polymer Direct Molding Technology
title_fullStr	Copper Surface Treatment in Metal-Polymer Direct Molding Technology
title_full_unstemmed	Copper Surface Treatment in Metal-Polymer Direct Molding Technology
title_sort	copper surface treatment in metal-polymer direct molding technology
publisher	Editorial Office of Journal of Shanghai Jiao Tong University
publishDate	2021
url	https://doaj.org/article/46ddab8adea24df78147d8b740fffe01
work_keys_str_mv	AT guorongsheng coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT huguanghong coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT rongjian coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology AT wangyuanlong coppersurfacetreatmentinmetalpolymerdirectmoldingtechnology
_version_	1718444956845080576

Copper Surface Treatment in Metal-Polymer Direct Molding Technology

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