Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal...
Guardado en:
| Autores principales: | , , |
|---|---|
| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Elsevier
2021
|
| Materias: | |
| Acceso en línea: | https://doaj.org/article/4d0a91be6b0c4ea5a8b6e4663b588e49 |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
| Sumario: | An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal activity and UV-barrier properties during 90 days of storage. The water vapor permeability (1.35 × 10−11 gm−1s−1Pa−1), water content (17.50%) and solubility (35.15%), optical and mechanical properties of chickpea flour films were comparable to that of other bio-based films. The properties of CFF did not change during storage. CFF had UV-light shielding behavior and copper-removal capacity. CFF blocked more than the 95% of the UV spectrum. Maximum Cu-removal capacity (∼ 99.5%) was no affected by the concentrations of copper ions studied. The adsorption data fitted the Langmuir adsorption model, suggesting monolayer coverage. These found properties and eco-friendliness endow the chickpea flour films with great application potential as active packaging film to protect foods against UV radiation and copper promoted oxidative degradation. |
|---|