Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties

An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal...

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Autores principales:	A Aguirre, X. Mendez, R Borneo
Formato:	article
Lenguaje:	EN
Publicado:	Elsevier 2021
Materias:	chickpea flour film active packaging UV-protective copper removal Food processing and manufacture TP368-456
Acceso en línea:	https://doaj.org/article/4d0a91be6b0c4ea5a8b6e4663b588e49
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spelling	oai:doaj.org-article:4d0a91be6b0c4ea5a8b6e4663b588e492021-12-02T05:04:56ZCharacterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties2772-502210.1016/j.afres.2021.100011https://doaj.org/article/4d0a91be6b0c4ea5a8b6e4663b588e492021-06-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S2772502221000111https://doaj.org/toc/2772-5022An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal activity and UV-barrier properties during 90 days of storage. The water vapor permeability (1.35 × 10−11 gm−1s−1Pa−1), water content (17.50%) and solubility (35.15%), optical and mechanical properties of chickpea flour films were comparable to that of other bio-based films. The properties of CFF did not change during storage. CFF had UV-light shielding behavior and copper-removal capacity. CFF blocked more than the 95% of the UV spectrum. Maximum Cu-removal capacity (∼ 99.5%) was no affected by the concentrations of copper ions studied. The adsorption data fitted the Langmuir adsorption model, suggesting monolayer coverage. These found properties and eco-friendliness endow the chickpea flour films with great application potential as active packaging film to protect foods against UV radiation and copper promoted oxidative degradation.A AguirreX. MendezR BorneoElsevierarticlechickpea flourfilmactive packagingUV-protectivecopper removalFood processing and manufactureTP368-456ENApplied Food Research, Vol 1, Iss 1, Pp 100011- (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	chickpea flour film active packaging UV-protective copper removal Food processing and manufacture TP368-456
spellingShingle	chickpea flour film active packaging UV-protective copper removal Food processing and manufacture TP368-456 A Aguirre X. Mendez R Borneo Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
description	An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal activity and UV-barrier properties during 90 days of storage. The water vapor permeability (1.35 × 10−11 gm−1s−1Pa−1), water content (17.50%) and solubility (35.15%), optical and mechanical properties of chickpea flour films were comparable to that of other bio-based films. The properties of CFF did not change during storage. CFF had UV-light shielding behavior and copper-removal capacity. CFF blocked more than the 95% of the UV spectrum. Maximum Cu-removal capacity (∼ 99.5%) was no affected by the concentrations of copper ions studied. The adsorption data fitted the Langmuir adsorption model, suggesting monolayer coverage. These found properties and eco-friendliness endow the chickpea flour films with great application potential as active packaging film to protect foods against UV radiation and copper promoted oxidative degradation.
format	article
author	A Aguirre X. Mendez R Borneo
author_facet	A Aguirre X. Mendez R Borneo
author_sort	A Aguirre
title	Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
title_short	Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
title_full	Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
title_fullStr	Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
title_full_unstemmed	Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties
title_sort	characterization and storage study of chickpea flour films with uv-barrier and cu-remove properties
publisher	Elsevier
publishDate	2021
url	https://doaj.org/article/4d0a91be6b0c4ea5a8b6e4663b588e49
work_keys_str_mv	AT aaguirre characterizationandstoragestudyofchickpeaflourfilmswithuvbarrierandcuremoveproperties AT xmendez characterizationandstoragestudyofchickpeaflourfilmswithuvbarrierandcuremoveproperties AT rborneo characterizationandstoragestudyofchickpeaflourfilmswithuvbarrierandcuremoveproperties
_version_	1718400588249563136

Characterization and storage study of chickpea flour films with UV-barrier and Cu-remove properties

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