Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper

Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have a...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Lung-Chuan Tsao, Cheng-Kai Li, Yu-Kai Sun, Shih-Ying Chang, Tung-Han Chuang
Formato:	article
Lenguaje:	EN
Publicado:	Hindawi Limited 2021
Materias:	Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/4d8fd439be964416b2fbd991a941db7d
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:4d8fd439be964416b2fbd991a941db7d
record_format	dspace
spelling	oai:doaj.org-article:4d8fd439be964416b2fbd991a941db7d2021-11-29T00:56:06ZFluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper1687-844210.1155/2021/8069719https://doaj.org/article/4d8fd439be964416b2fbd991a941db7d2021-01-01T00:00:00Zhttp://dx.doi.org/10.1155/2021/8069719https://doaj.org/toc/1687-8442Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. The direct soldering process was performed without the need for flux or pre-metallization of the two transparent conductive oxides. The microstructure, phase constitution, melting characteristics, and soldering properties of the Sn8Zn3Bi1Mg active solder were investigated. The liquidus temperature of the Sn8Zn3Bi1Mg active solder was 198.6°C, which was very close to the binary Sn-Zn eutectic temperature of 198.5°C. The effect of temperature on the bonding strength of the solder joints was evaluated. The shear strengths of AZO/Cu and ZnO/Cu joints soldered with Sn8Zn3Bi1Mg active solder were 10.3 and 7.5 MPa at room temperature, respectively. Increasing the temperature from room temperature to 180°C reduced the bonding shear strengths of AZO/Cu and ZnO/Cu joints to 3.3 and 3.7 MPa, respectively.Lung-Chuan TsaoCheng-Kai LiYu-Kai SunShih-Ying ChangTung-Han ChuangHindawi LimitedarticleMaterials of engineering and construction. Mechanics of materialsTA401-492ENAdvances in Materials Science and Engineering, Vol 2021 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Materials of engineering and construction. Mechanics of materials TA401-492 Lung-Chuan Tsao Cheng-Kai Li Yu-Kai Sun Shih-Ying Chang Tung-Han Chuang Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
description	Due to the combined advantages of low cost, good soldering properties, and appropriate melting temperature range, novel Sn8Zn3Bi1Mg active solder was developed for direct soldering of transparent conductive oxide (TCO) ceramic targets with oxygen-free copper at 200°C in air. The TCO specimens have aluminum-doped zinc oxide (AZO) and zinc oxide (ZnO) ceramics. The direct soldering process was performed without the need for flux or pre-metallization of the two transparent conductive oxides. The microstructure, phase constitution, melting characteristics, and soldering properties of the Sn8Zn3Bi1Mg active solder were investigated. The liquidus temperature of the Sn8Zn3Bi1Mg active solder was 198.6°C, which was very close to the binary Sn-Zn eutectic temperature of 198.5°C. The effect of temperature on the bonding strength of the solder joints was evaluated. The shear strengths of AZO/Cu and ZnO/Cu joints soldered with Sn8Zn3Bi1Mg active solder were 10.3 and 7.5 MPa at room temperature, respectively. Increasing the temperature from room temperature to 180°C reduced the bonding shear strengths of AZO/Cu and ZnO/Cu joints to 3.3 and 3.7 MPa, respectively.
format	article
author	Lung-Chuan Tsao Cheng-Kai Li Yu-Kai Sun Shih-Ying Chang Tung-Han Chuang
author_facet	Lung-Chuan Tsao Cheng-Kai Li Yu-Kai Sun Shih-Ying Chang Tung-Han Chuang
author_sort	Lung-Chuan Tsao
title	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
title_short	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
title_full	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
title_fullStr	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
title_full_unstemmed	Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper
title_sort	fluxless direct soldering of transparent conductive oxides (tcos) to copper
publisher	Hindawi Limited
publishDate	2021
url	https://doaj.org/article/4d8fd439be964416b2fbd991a941db7d
work_keys_str_mv	AT lungchuantsao fluxlessdirectsolderingoftransparentconductiveoxidestcostocopper AT chengkaili fluxlessdirectsolderingoftransparentconductiveoxidestcostocopper AT yukaisun fluxlessdirectsolderingoftransparentconductiveoxidestcostocopper AT shihyingchang fluxlessdirectsolderingoftransparentconductiveoxidestcostocopper AT tunghanchuang fluxlessdirectsolderingoftransparentconductiveoxidestcostocopper
_version_	1718407704714674176

Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper

Ejemplares similares