Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires
Abstract In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0...
Guardado en:
Autores principales: | , , , , , , , , , , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
Nature Portfolio
2017
|
Materias: | |
Acceso en línea: | https://doaj.org/article/4e2948799dec4cc69c18c8cdd5d3bc9e |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:doaj.org-article:4e2948799dec4cc69c18c8cdd5d3bc9e |
---|---|
record_format |
dspace |
spelling |
oai:doaj.org-article:4e2948799dec4cc69c18c8cdd5d3bc9e2021-12-02T15:04:55ZEnhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires10.1038/s41598-017-02929-02045-2322https://doaj.org/article/4e2948799dec4cc69c18c8cdd5d3bc9e2017-06-01T00:00:00Zhttps://doi.org/10.1038/s41598-017-02929-0https://doaj.org/toc/2045-2322Abstract In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm−1 K−1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.Dianyu ShenZhaolin ZhanZhiduo LiuYong CaoLi ZhouYuanli LiuWen DaiKazuhito NishimuraChaoyang LiCheng-Te LinNan JiangJinhong YuNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 7, Iss 1, Pp 1-11 (2017) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
Medicine R Science Q |
spellingShingle |
Medicine R Science Q Dianyu Shen Zhaolin Zhan Zhiduo Liu Yong Cao Li Zhou Yuanli Liu Wen Dai Kazuhito Nishimura Chaoyang Li Cheng-Te Lin Nan Jiang Jinhong Yu Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
description |
Abstract In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm−1 K−1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices. |
format |
article |
author |
Dianyu Shen Zhaolin Zhan Zhiduo Liu Yong Cao Li Zhou Yuanli Liu Wen Dai Kazuhito Nishimura Chaoyang Li Cheng-Te Lin Nan Jiang Jinhong Yu |
author_facet |
Dianyu Shen Zhaolin Zhan Zhiduo Liu Yong Cao Li Zhou Yuanli Liu Wen Dai Kazuhito Nishimura Chaoyang Li Cheng-Te Lin Nan Jiang Jinhong Yu |
author_sort |
Dianyu Shen |
title |
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
title_short |
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
title_full |
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
title_fullStr |
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
title_full_unstemmed |
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
title_sort |
enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires |
publisher |
Nature Portfolio |
publishDate |
2017 |
url |
https://doaj.org/article/4e2948799dec4cc69c18c8cdd5d3bc9e |
work_keys_str_mv |
AT dianyushen enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT zhaolinzhan enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT zhiduoliu enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT yongcao enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT lizhou enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT yuanliliu enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT wendai enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT kazuhitonishimura enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT chaoyangli enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT chengtelin enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT nanjiang enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires AT jinhongyu enhancedthermalconductivityofepoxycompositesfilledwithsiliconcarbidenanowires |
_version_ |
1718388952795185152 |