Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface

The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat...

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Autores principales:	Junghyun Park, Donghyun Kim, Hyunsik Kim, Junghoon Lee, Wonsub Chung
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	heat dissipation electrodeposition emissivity copper oxide radiative heat transfer Chemistry QD1-999
Acceso en línea:	https://doaj.org/article/4fd013ee6aae4b93b15641dc719ca238
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id	oai:doaj.org-article:4fd013ee6aae4b93b15641dc719ca238
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spelling	oai:doaj.org-article:4fd013ee6aae4b93b15641dc719ca2382021-11-25T18:30:03ZThermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface10.3390/nano111128192079-4991https://doaj.org/article/4fd013ee6aae4b93b15641dc719ca2382021-10-01T00:00:00Zhttps://www.mdpi.com/2079-4991/11/11/2819https://doaj.org/toc/2079-4991The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat treatment formed a nanoporous oxide layer containing CuO and Cu<sub>2</sub>O, which has a dark blackish color and therefore increased the thermal emissivity of the surface. The heat dissipation performance was evaluated using the sample as a heat sink for an LED module. The surface-treated copper heat sink with a high thermal emissivity oxide layer enhanced the heat dissipation of the LED module and allowed it to be operated at a lower temperature. With an increase in the heat treatment, the thermal emissivity increases to 0.865, but the thermal diffusivity is lower than the copper substrate by ~12%. These results indicate that the oxide layer is a thermal barrier for heat transfer, thus optimization between the oxide thickness and thermal emissivity is required by evaluating heat dissipation performance in operating conditions. In this study, an oxide layer with an emissivity of 0.857 and ~5% lower thermal diffusivity than the copper substrate showed the lowest LED operating temperature.Junghyun ParkDonghyun KimHyunsik KimJunghoon LeeWonsub ChungMDPI AGarticleheat dissipationelectrodepositionemissivitycopper oxideradiative heat transferChemistryQD1-999ENNanomaterials, Vol 11, Iss 2819, p 2819 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	heat dissipation electrodeposition emissivity copper oxide radiative heat transfer Chemistry QD1-999
spellingShingle	heat dissipation electrodeposition emissivity copper oxide radiative heat transfer Chemistry QD1-999 Junghyun Park Donghyun Kim Hyunsik Kim Junghoon Lee Wonsub Chung Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
description	The heat dissipation of a metal heat sink for passive cooling can be enhanced by surface modifications to increase its thermal emissivity, which is reflected by a darker surface appearance. In this study, copper electrodeposition followed by heat treatment was applied to a copper substrate. The heat treatment formed a nanoporous oxide layer containing CuO and Cu<sub>2</sub>O, which has a dark blackish color and therefore increased the thermal emissivity of the surface. The heat dissipation performance was evaluated using the sample as a heat sink for an LED module. The surface-treated copper heat sink with a high thermal emissivity oxide layer enhanced the heat dissipation of the LED module and allowed it to be operated at a lower temperature. With an increase in the heat treatment, the thermal emissivity increases to 0.865, but the thermal diffusivity is lower than the copper substrate by ~12%. These results indicate that the oxide layer is a thermal barrier for heat transfer, thus optimization between the oxide thickness and thermal emissivity is required by evaluating heat dissipation performance in operating conditions. In this study, an oxide layer with an emissivity of 0.857 and ~5% lower thermal diffusivity than the copper substrate showed the lowest LED operating temperature.
format	article
author	Junghyun Park Donghyun Kim Hyunsik Kim Junghoon Lee Wonsub Chung
author_facet	Junghyun Park Donghyun Kim Hyunsik Kim Junghoon Lee Wonsub Chung
author_sort	Junghyun Park
title	Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
title_short	Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
title_full	Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
title_fullStr	Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
title_full_unstemmed	Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface
title_sort	thermal radiative copper oxide layer for enhancing heat dissipation of metal surface
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/4fd013ee6aae4b93b15641dc719ca238
work_keys_str_mv	AT junghyunpark thermalradiativecopperoxidelayerforenhancingheatdissipationofmetalsurface AT donghyunkim thermalradiativecopperoxidelayerforenhancingheatdissipationofmetalsurface AT hyunsikkim thermalradiativecopperoxidelayerforenhancingheatdissipationofmetalsurface AT junghoonlee thermalradiativecopperoxidelayerforenhancingheatdissipationofmetalsurface AT wonsubchung thermalradiativecopperoxidelayerforenhancingheatdissipationofmetalsurface
_version_	1718411073215791104

Thermal Radiative Copper Oxide Layer for Enhancing Heat Dissipation of Metal Surface

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