Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion l...
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oai:doaj.org-article:50d41a8295754e9f9a75cd6ce1da56cf2021-12-04T04:33:22ZUnderstanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring1350-417710.1016/j.ultsonch.2021.105856https://doaj.org/article/50d41a8295754e9f9a75cd6ce1da56cf2021-12-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S1350417721003989https://doaj.org/toc/1350-4177Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion layer agitation caused by cavitation during ultrasonic electroplating. Here, we investigate the main factor of agitation by using a high-speed imaging technique to capture the agitation effect of shock waves and microjets generated from laser-induced cavitation on the diffusion layer of electroplating. The physical parameters of the agitation were characterized using image analysis and a micro-pressure gauge. The results revealed that only microjets affected the agitation phenomenon. The flow velocity was 21 m/s, and the water hammer pressure was low, at least below 0.05 MPa. Our results suggest that the flow velocity, and not the water hammer pressure, plays an important role in the agitation phenomenon on the substrate surface by cavitation.Taisuke NozawaKeiichi NakagawaElsevierarticleChemistryQD1-999Acoustics. SoundQC221-246ENUltrasonics Sonochemistry, Vol 81, Iss , Pp 105856- (2021) |
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Chemistry QD1-999 Acoustics. Sound QC221-246 |
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Chemistry QD1-999 Acoustics. Sound QC221-246 Taisuke Nozawa Keiichi Nakagawa Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
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Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion layer agitation caused by cavitation during ultrasonic electroplating. Here, we investigate the main factor of agitation by using a high-speed imaging technique to capture the agitation effect of shock waves and microjets generated from laser-induced cavitation on the diffusion layer of electroplating. The physical parameters of the agitation were characterized using image analysis and a micro-pressure gauge. The results revealed that only microjets affected the agitation phenomenon. The flow velocity was 21 m/s, and the water hammer pressure was low, at least below 0.05 MPa. Our results suggest that the flow velocity, and not the water hammer pressure, plays an important role in the agitation phenomenon on the substrate surface by cavitation. |
format |
article |
author |
Taisuke Nozawa Keiichi Nakagawa |
author_facet |
Taisuke Nozawa Keiichi Nakagawa |
author_sort |
Taisuke Nozawa |
title |
Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
title_short |
Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
title_full |
Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
title_fullStr |
Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
title_full_unstemmed |
Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
title_sort |
understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring |
publisher |
Elsevier |
publishDate |
2021 |
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https://doaj.org/article/50d41a8295754e9f9a75cd6ce1da56cf |
work_keys_str_mv |
AT taisukenozawa understandingdiffusionlayeragitationbycavitationinelectroplatingbasedonhighspeedmonitoring AT keiichinakagawa understandingdiffusionlayeragitationbycavitationinelectroplatingbasedonhighspeedmonitoring |
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1718372965551177728 |