Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring

Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion l...

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Autores principales:	Taisuke Nozawa, Keiichi Nakagawa
Formato:	article
Lenguaje:	EN
Publicado:	Elsevier 2021
Materias:	Chemistry QD1-999 Acoustics. Sound QC221-246
Acceso en línea:	https://doaj.org/article/50d41a8295754e9f9a75cd6ce1da56cf
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spelling	oai:doaj.org-article:50d41a8295754e9f9a75cd6ce1da56cf2021-12-04T04:33:22ZUnderstanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring1350-417710.1016/j.ultsonch.2021.105856https://doaj.org/article/50d41a8295754e9f9a75cd6ce1da56cf2021-12-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S1350417721003989https://doaj.org/toc/1350-4177Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion layer agitation caused by cavitation during ultrasonic electroplating. Here, we investigate the main factor of agitation by using a high-speed imaging technique to capture the agitation effect of shock waves and microjets generated from laser-induced cavitation on the diffusion layer of electroplating. The physical parameters of the agitation were characterized using image analysis and a micro-pressure gauge. The results revealed that only microjets affected the agitation phenomenon. The flow velocity was 21 m/s, and the water hammer pressure was low, at least below 0.05 MPa. Our results suggest that the flow velocity, and not the water hammer pressure, plays an important role in the agitation phenomenon on the substrate surface by cavitation.Taisuke NozawaKeiichi NakagawaElsevierarticleChemistryQD1-999Acoustics. SoundQC221-246ENUltrasonics Sonochemistry, Vol 81, Iss , Pp 105856- (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Chemistry QD1-999 Acoustics. Sound QC221-246
spellingShingle	Chemistry QD1-999 Acoustics. Sound QC221-246 Taisuke Nozawa Keiichi Nakagawa Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
description	Ultrasonic electroplating has gained attention owing to various advantages such as the promotion of mass transport to the substrate surface, improvement of the surface properties of the film, and improvement of limiting current density. However, no studies have clarified the mechanism in diffusion layer agitation caused by cavitation during ultrasonic electroplating. Here, we investigate the main factor of agitation by using a high-speed imaging technique to capture the agitation effect of shock waves and microjets generated from laser-induced cavitation on the diffusion layer of electroplating. The physical parameters of the agitation were characterized using image analysis and a micro-pressure gauge. The results revealed that only microjets affected the agitation phenomenon. The flow velocity was 21 m/s, and the water hammer pressure was low, at least below 0.05 MPa. Our results suggest that the flow velocity, and not the water hammer pressure, plays an important role in the agitation phenomenon on the substrate surface by cavitation.
format	article
author	Taisuke Nozawa Keiichi Nakagawa
author_facet	Taisuke Nozawa Keiichi Nakagawa
author_sort	Taisuke Nozawa
title	Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
title_short	Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
title_full	Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
title_fullStr	Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
title_full_unstemmed	Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
title_sort	understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring
publisher	Elsevier
publishDate	2021
url	https://doaj.org/article/50d41a8295754e9f9a75cd6ce1da56cf
work_keys_str_mv	AT taisukenozawa understandingdiffusionlayeragitationbycavitationinelectroplatingbasedonhighspeedmonitoring AT keiichinakagawa understandingdiffusionlayeragitationbycavitationinelectroplatingbasedonhighspeedmonitoring
_version_	1718372965551177728

Understanding diffusion layer agitation by cavitation in electroplating based on high-speed monitoring

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