Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and pr...

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Autor principal:	Alaa Hasan Ali
Formato:	article
Lenguaje:	EN
Publicado:	Al-Khwarizmi College of Engineering – University of Baghdad 2014
Materias:	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/572efbe1155c45ada4f491c2b4f63151
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spelling	oai:doaj.org-article:572efbe1155c45ada4f491c2b4f631512021-12-02T07:35:31ZComparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits 1818-1171https://doaj.org/article/572efbe1155c45ada4f491c2b4f631512014-06-01T00:00:00Zhttp://www.iasj.net/iasj?func=fulltext&aId=90290https://doaj.org/toc/1818-1171This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead-free tin based solder and that was compared with simulation using a Crystal Plasticity Finite Element (CPEF) method that has the anisotropy of Sn installed. The results and experiments were in good agreement, indicating the range of values expected with anisotropic properties.Alaa Hasan AliAl-Khwarizmi College of Engineering – University of BaghdadarticleChemical engineeringTP155-156Engineering (General). Civil engineering (General)TA1-2040ENAl-Khawarizmi Engineering Journal, Vol 10, Iss 2, Pp 32-48 (2014)
institution	DOAJ
collection	DOAJ
language	EN
topic	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040 Alaa Hasan Ali Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
description	This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead-free tin based solder and that was compared with simulation using a Crystal Plasticity Finite Element (CPEF) method that has the anisotropy of Sn installed. The results and experiments were in good agreement, indicating the range of values expected with anisotropic properties.
format	article
author	Alaa Hasan Ali
author_facet	Alaa Hasan Ali
author_sort	Alaa Hasan Ali
title	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_short	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_full	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_fullStr	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_full_unstemmed	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_sort	comparisons of mechanical properties of sub-mm lead based and lead free based solder using in manufacturing of printed circuits
publisher	Al-Khwarizmi College of Engineering – University of Baghdad
publishDate	2014
url	https://doaj.org/article/572efbe1155c45ada4f491c2b4f63151
work_keys_str_mv	AT alaahasanali comparisonsofmechanicalpropertiesofsubmmleadbasedandleadfreebasedsolderusinginmanufacturingofprintedcircuits
_version_	1718399336392425472

Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

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