Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conduc...
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2021
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oai:doaj.org-article:58f8402395334058ab4807c14047bf842021-11-25T17:15:44ZHighly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC10.3390/coatings111112982079-6412https://doaj.org/article/58f8402395334058ab4807c14047bf842021-10-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1298https://doaj.org/toc/2079-6412Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conductivity. In this work, we proposed doping Mn-Co spinel powder with Cu via a solid phase reaction. Cu<sub>δ</sub>Mn<sub>1.5−x</sub>Co<sub>1.5−y</sub>O<sub>4</sub> with δ = 0.1, 0.2, 0.3, and x + y = δ was obtained. X-ray diffraction (XRD) and thermogravimetry-differential scanning calorimetry (TG-DSC) were used to evaluate the Cu-doping effect. After sintering at 1000 °C for 12 h, the yield exhibited the best crystallinity, density, and element distribution, with a phase composition of MnCo<sub>2</sub>O<sub>4</sub>/Cu<sub>x</sub>Mn<sub>3−x</sub>O<sub>4</sub> (x = 1, 1.2, 1.4 or 1.5). X-ray photoelectron spectroscopy (XPS) was used to semi-quantitatively characterize the content changes in element valence states. The areal fraction of Mn<sup>2+</sup> and Co<sup>3+</sup> was found to decrease when the sintering duration increased, which was attributed to the decomposition of the MnCo<sub>2</sub>O<sub>4</sub> phase. Finally, coatings were prepared by atmospheric plasma spraying with doped spinel powders and the raw powder Mn<sub>1.5</sub>Co<sub>1.5</sub>O<sub>4</sub>. It was found that Cu doping can effectively increase the conductivity of Mn-Co spinel coatings from 23 S/cm to 51 S/cm. Although the dopant Cu was found to be enriched on the surface of the coatings after the conductivity measurement, which restrained the doping effect, Cu doping remains a convenient method to significantly promote the conductivity of spinel coatings for SOFC applications.Zhou JiangKui WenChen SongTaikai LiuYong DongMin LiuChangguang DengChunming DengChenghao YangMDPI AGarticleMn-Co spinelCu dopingconductivitySOFCinterconnectEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1298, p 1298 (2021) |
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Mn-Co spinel Cu doping conductivity SOFC interconnect Engineering (General). Civil engineering (General) TA1-2040 |
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Mn-Co spinel Cu doping conductivity SOFC interconnect Engineering (General). Civil engineering (General) TA1-2040 Zhou Jiang Kui Wen Chen Song Taikai Liu Yong Dong Min Liu Changguang Deng Chunming Deng Chenghao Yang Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
description |
Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conductivity. In this work, we proposed doping Mn-Co spinel powder with Cu via a solid phase reaction. Cu<sub>δ</sub>Mn<sub>1.5−x</sub>Co<sub>1.5−y</sub>O<sub>4</sub> with δ = 0.1, 0.2, 0.3, and x + y = δ was obtained. X-ray diffraction (XRD) and thermogravimetry-differential scanning calorimetry (TG-DSC) were used to evaluate the Cu-doping effect. After sintering at 1000 °C for 12 h, the yield exhibited the best crystallinity, density, and element distribution, with a phase composition of MnCo<sub>2</sub>O<sub>4</sub>/Cu<sub>x</sub>Mn<sub>3−x</sub>O<sub>4</sub> (x = 1, 1.2, 1.4 or 1.5). X-ray photoelectron spectroscopy (XPS) was used to semi-quantitatively characterize the content changes in element valence states. The areal fraction of Mn<sup>2+</sup> and Co<sup>3+</sup> was found to decrease when the sintering duration increased, which was attributed to the decomposition of the MnCo<sub>2</sub>O<sub>4</sub> phase. Finally, coatings were prepared by atmospheric plasma spraying with doped spinel powders and the raw powder Mn<sub>1.5</sub>Co<sub>1.5</sub>O<sub>4</sub>. It was found that Cu doping can effectively increase the conductivity of Mn-Co spinel coatings from 23 S/cm to 51 S/cm. Although the dopant Cu was found to be enriched on the surface of the coatings after the conductivity measurement, which restrained the doping effect, Cu doping remains a convenient method to significantly promote the conductivity of spinel coatings for SOFC applications. |
format |
article |
author |
Zhou Jiang Kui Wen Chen Song Taikai Liu Yong Dong Min Liu Changguang Deng Chunming Deng Chenghao Yang |
author_facet |
Zhou Jiang Kui Wen Chen Song Taikai Liu Yong Dong Min Liu Changguang Deng Chunming Deng Chenghao Yang |
author_sort |
Zhou Jiang |
title |
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
title_short |
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
title_full |
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
title_fullStr |
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
title_full_unstemmed |
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC |
title_sort |
highly conductive mn-co spinel powder prepared by cu-doping used for interconnect protection of sofc |
publisher |
MDPI AG |
publishDate |
2021 |
url |
https://doaj.org/article/58f8402395334058ab4807c14047bf84 |
work_keys_str_mv |
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_version_ |
1718412588101926912 |