Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC

Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conduc...

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Autores principales: Zhou Jiang, Kui Wen, Chen Song, Taikai Liu, Yong Dong, Min Liu, Changguang Deng, Chunming Deng, Chenghao Yang
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Publicado: MDPI AG 2021
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spelling oai:doaj.org-article:58f8402395334058ab4807c14047bf842021-11-25T17:15:44ZHighly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC10.3390/coatings111112982079-6412https://doaj.org/article/58f8402395334058ab4807c14047bf842021-10-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1298https://doaj.org/toc/2079-6412Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conductivity. In this work, we proposed doping Mn-Co spinel powder with Cu via a solid phase reaction. Cu<sub>δ</sub>Mn<sub>1.5−x</sub>Co<sub>1.5−y</sub>O<sub>4</sub> with δ = 0.1, 0.2, 0.3, and x + y = δ was obtained. X-ray diffraction (XRD) and thermogravimetry-differential scanning calorimetry (TG-DSC) were used to evaluate the Cu-doping effect. After sintering at 1000 °C for 12 h, the yield exhibited the best crystallinity, density, and element distribution, with a phase composition of MnCo<sub>2</sub>O<sub>4</sub>/Cu<sub>x</sub>Mn<sub>3−x</sub>O<sub>4</sub> (x = 1, 1.2, 1.4 or 1.5). X-ray photoelectron spectroscopy (XPS) was used to semi-quantitatively characterize the content changes in element valence states. The areal fraction of Mn<sup>2+</sup> and Co<sup>3+</sup> was found to decrease when the sintering duration increased, which was attributed to the decomposition of the MnCo<sub>2</sub>O<sub>4</sub> phase. Finally, coatings were prepared by atmospheric plasma spraying with doped spinel powders and the raw powder Mn<sub>1.5</sub>Co<sub>1.5</sub>O<sub>4</sub>. It was found that Cu doping can effectively increase the conductivity of Mn-Co spinel coatings from 23 S/cm to 51 S/cm. Although the dopant Cu was found to be enriched on the surface of the coatings after the conductivity measurement, which restrained the doping effect, Cu doping remains a convenient method to significantly promote the conductivity of spinel coatings for SOFC applications.Zhou JiangKui WenChen SongTaikai LiuYong DongMin LiuChangguang DengChunming DengChenghao YangMDPI AGarticleMn-Co spinelCu dopingconductivitySOFCinterconnectEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1298, p 1298 (2021)
institution DOAJ
collection DOAJ
language EN
topic Mn-Co spinel
Cu doping
conductivity
SOFC
interconnect
Engineering (General). Civil engineering (General)
TA1-2040
spellingShingle Mn-Co spinel
Cu doping
conductivity
SOFC
interconnect
Engineering (General). Civil engineering (General)
TA1-2040
Zhou Jiang
Kui Wen
Chen Song
Taikai Liu
Yong Dong
Min Liu
Changguang Deng
Chunming Deng
Chenghao Yang
Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
description Mn-Co Spinel is considered as one of the most promising materials for the interconnect protection of solid oxide fuel cells; however, its conductivity is too low to maintain a high cell performance as compared with cathode materials. Element doping is an effective method to improve the spinel conductivity. In this work, we proposed doping Mn-Co spinel powder with Cu via a solid phase reaction. Cu<sub>δ</sub>Mn<sub>1.5−x</sub>Co<sub>1.5−y</sub>O<sub>4</sub> with δ = 0.1, 0.2, 0.3, and x + y = δ was obtained. X-ray diffraction (XRD) and thermogravimetry-differential scanning calorimetry (TG-DSC) were used to evaluate the Cu-doping effect. After sintering at 1000 °C for 12 h, the yield exhibited the best crystallinity, density, and element distribution, with a phase composition of MnCo<sub>2</sub>O<sub>4</sub>/Cu<sub>x</sub>Mn<sub>3−x</sub>O<sub>4</sub> (x = 1, 1.2, 1.4 or 1.5). X-ray photoelectron spectroscopy (XPS) was used to semi-quantitatively characterize the content changes in element valence states. The areal fraction of Mn<sup>2+</sup> and Co<sup>3+</sup> was found to decrease when the sintering duration increased, which was attributed to the decomposition of the MnCo<sub>2</sub>O<sub>4</sub> phase. Finally, coatings were prepared by atmospheric plasma spraying with doped spinel powders and the raw powder Mn<sub>1.5</sub>Co<sub>1.5</sub>O<sub>4</sub>. It was found that Cu doping can effectively increase the conductivity of Mn-Co spinel coatings from 23 S/cm to 51 S/cm. Although the dopant Cu was found to be enriched on the surface of the coatings after the conductivity measurement, which restrained the doping effect, Cu doping remains a convenient method to significantly promote the conductivity of spinel coatings for SOFC applications.
format article
author Zhou Jiang
Kui Wen
Chen Song
Taikai Liu
Yong Dong
Min Liu
Changguang Deng
Chunming Deng
Chenghao Yang
author_facet Zhou Jiang
Kui Wen
Chen Song
Taikai Liu
Yong Dong
Min Liu
Changguang Deng
Chunming Deng
Chenghao Yang
author_sort Zhou Jiang
title Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
title_short Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
title_full Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
title_fullStr Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
title_full_unstemmed Highly Conductive Mn-Co Spinel Powder Prepared by Cu-Doping Used for Interconnect Protection of SOFC
title_sort highly conductive mn-co spinel powder prepared by cu-doping used for interconnect protection of sofc
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/58f8402395334058ab4807c14047bf84
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AT taikailiu highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
AT yongdong highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
AT minliu highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
AT changguangdeng highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
AT chunmingdeng highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
AT chenghaoyang highlyconductivemncospinelpowderpreparedbycudopingusedforinterconnectprotectionofsofc
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