Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface

Intermetallic compounds (IMC) are found in the dual-layer composite, such as Si/Cu composite in multilayer semiconductor structures, and are often ignored in simulations that aim to predict the mechanical properties. The interface model of Si/Cu composites with different thickness of IMC layer is fi...

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Autores principales:	Chaoyue Ji, Xintian Cai, Zhen Zhou, Fang Dong, Sheng Liu, Bing Gao
Formato:	article
Lenguaje:	EN
Publicado:	Elsevier 2021
Materias:	Intermetallic compound Mechanical property Molecular dynamics Silicon-copper interface Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/5949a4b77f3e42ae9c0c5f936d99d865
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id	oai:doaj.org-article:5949a4b77f3e42ae9c0c5f936d99d865
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spelling	oai:doaj.org-article:5949a4b77f3e42ae9c0c5f936d99d8652021-11-28T04:27:41ZEffects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface0264-127510.1016/j.matdes.2021.110251https://doaj.org/article/5949a4b77f3e42ae9c0c5f936d99d8652021-12-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S0264127521008066https://doaj.org/toc/0264-1275Intermetallic compounds (IMC) are found in the dual-layer composite, such as Si/Cu composite in multilayer semiconductor structures, and are often ignored in simulations that aim to predict the mechanical properties. The interface model of Si/Cu composites with different thickness of IMC layer is first established by molecular dynamics simulation. Then this study analyzed the elastoplastic behavior and adhesion behavior of the Si/Cu interface and the effect of IMC on the fracture properties. The simulation results demonstrate that the Si/Cu interface fails in a quasi-brittle fracture mode. The crack propagates along the interface between Si and the IMC layer. An apparent dislocation emission and large plastic deformation are found exclusively in the Cu layer. The thickness of the IMC layer increased from 2 to 10 Å, and the critical strain energy release rate increased from 14.48 J/m2 to 19.76 J/m2, while the equivalent modulus is not increase monotonically. Therefore, the IMC is of high significance for predicting the mechanical properties of the dual-layer composite.Chaoyue JiXintian CaiZhen ZhouFang DongSheng LiuBing GaoElsevierarticleIntermetallic compoundMechanical propertyMolecular dynamicsSilicon-copper interfaceMaterials of engineering and construction. Mechanics of materialsTA401-492ENMaterials & Design, Vol 212, Iss , Pp 110251- (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Intermetallic compound Mechanical property Molecular dynamics Silicon-copper interface Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Intermetallic compound Mechanical property Molecular dynamics Silicon-copper interface Materials of engineering and construction. Mechanics of materials TA401-492 Chaoyue Ji Xintian Cai Zhen Zhou Fang Dong Sheng Liu Bing Gao Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
description	Intermetallic compounds (IMC) are found in the dual-layer composite, such as Si/Cu composite in multilayer semiconductor structures, and are often ignored in simulations that aim to predict the mechanical properties. The interface model of Si/Cu composites with different thickness of IMC layer is first established by molecular dynamics simulation. Then this study analyzed the elastoplastic behavior and adhesion behavior of the Si/Cu interface and the effect of IMC on the fracture properties. The simulation results demonstrate that the Si/Cu interface fails in a quasi-brittle fracture mode. The crack propagates along the interface between Si and the IMC layer. An apparent dislocation emission and large plastic deformation are found exclusively in the Cu layer. The thickness of the IMC layer increased from 2 to 10 Å, and the critical strain energy release rate increased from 14.48 J/m2 to 19.76 J/m2, while the equivalent modulus is not increase monotonically. Therefore, the IMC is of high significance for predicting the mechanical properties of the dual-layer composite.
format	article
author	Chaoyue Ji Xintian Cai Zhen Zhou Fang Dong Sheng Liu Bing Gao
author_facet	Chaoyue Ji Xintian Cai Zhen Zhou Fang Dong Sheng Liu Bing Gao
author_sort	Chaoyue Ji
title	Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
title_short	Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
title_full	Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
title_fullStr	Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
title_full_unstemmed	Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
title_sort	effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface
publisher	Elsevier
publishDate	2021
url	https://doaj.org/article/5949a4b77f3e42ae9c0c5f936d99d865
work_keys_str_mv	AT chaoyueji effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface AT xintiancai effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface AT zhenzhou effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface AT fangdong effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface AT shengliu effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface AT binggao effectsofintermetalliccompoundlayerthicknessonthemechanicalpropertiesofsiliconcopperinterface
_version_	1718408379808874496

Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface

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