Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings

Phase change materials (PCMs) have been used in the development of building materials with higher thermal energy storage capacity. Especially, PCM incorporated gypsum plasterboard has been described to decrease the cooling demand of building by up to 35%. However, it’s significantly important to fab...

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Autores principales: Maitiniyazi Bake, Ashish Shukla, Shuli Liu
Formato: article
Lenguaje:EN
Publicado: KeAi Communications Co., Ltd. 2021
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Acceso en línea:https://doaj.org/article/598c7176e7d44fb598dae28f6be3923a
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spelling oai:doaj.org-article:598c7176e7d44fb598dae28f6be3923a2021-11-30T04:16:58ZDevelopment of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings2589-299110.1016/j.mset.2021.05.001https://doaj.org/article/598c7176e7d44fb598dae28f6be3923a2021-01-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S258929912100015Xhttps://doaj.org/toc/2589-2991Phase change materials (PCMs) have been used in the development of building materials with higher thermal energy storage capacity. Especially, PCM incorporated gypsum plasterboard has been described to decrease the cooling demand of building by up to 35%. However, it’s significantly important to fabricate and characterise the thermal/physical properties of PCM-gypsum plasterboard accurately. This paper presented the fabrication process and property measurement of gypsum plasterboard integrated with microencapsulated PCM (mPCM). Property measurement included scanning electron microscope (SEM) technique, sting, density measurement, compressive strength test, and thermal conductivity testing. The characterisation results show that: (i) the gypsum plasterboard enhanced with 5% and 15% PCM claim 5.36 and 4.34 MPa respectively; (ii) with the addition of 15% PCM, the gypsum plasterboard presented the lowest value of thermal conductivity as 0.139 W/mK; (iii) The mPCM-gypsum plasterboard also operates longer period of time than gypsum plasterboard with higher temperature of roughly 1.5 °C especially during discharging period; (iv) The mPCM-pasteboard provided 0.4 W/min higher stored energy than gypsum plasterboard due to the addition of mPCM.Maitiniyazi BakeAshish ShuklaShuli LiuKeAi Communications Co., Ltd.articlePhase change materialsMicroencapsulationThermal propertiesBuilding materialGypsumMaterials of engineering and construction. Mechanics of materialsTA401-492Energy conservationTJ163.26-163.5ENMaterials Science for Energy Technologies, Vol 4, Iss , Pp 166-176 (2021)
institution DOAJ
collection DOAJ
language EN
topic Phase change materials
Microencapsulation
Thermal properties
Building material
Gypsum
Materials of engineering and construction. Mechanics of materials
TA401-492
Energy conservation
TJ163.26-163.5
spellingShingle Phase change materials
Microencapsulation
Thermal properties
Building material
Gypsum
Materials of engineering and construction. Mechanics of materials
TA401-492
Energy conservation
TJ163.26-163.5
Maitiniyazi Bake
Ashish Shukla
Shuli Liu
Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
description Phase change materials (PCMs) have been used in the development of building materials with higher thermal energy storage capacity. Especially, PCM incorporated gypsum plasterboard has been described to decrease the cooling demand of building by up to 35%. However, it’s significantly important to fabricate and characterise the thermal/physical properties of PCM-gypsum plasterboard accurately. This paper presented the fabrication process and property measurement of gypsum plasterboard integrated with microencapsulated PCM (mPCM). Property measurement included scanning electron microscope (SEM) technique, sting, density measurement, compressive strength test, and thermal conductivity testing. The characterisation results show that: (i) the gypsum plasterboard enhanced with 5% and 15% PCM claim 5.36 and 4.34 MPa respectively; (ii) with the addition of 15% PCM, the gypsum plasterboard presented the lowest value of thermal conductivity as 0.139 W/mK; (iii) The mPCM-gypsum plasterboard also operates longer period of time than gypsum plasterboard with higher temperature of roughly 1.5 °C especially during discharging period; (iv) The mPCM-pasteboard provided 0.4 W/min higher stored energy than gypsum plasterboard due to the addition of mPCM.
format article
author Maitiniyazi Bake
Ashish Shukla
Shuli Liu
author_facet Maitiniyazi Bake
Ashish Shukla
Shuli Liu
author_sort Maitiniyazi Bake
title Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
title_short Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
title_full Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
title_fullStr Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
title_full_unstemmed Development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
title_sort development of gypsum plasterboard embodied with microencapsulated phase change material for energy efficient buildings
publisher KeAi Communications Co., Ltd.
publishDate 2021
url https://doaj.org/article/598c7176e7d44fb598dae28f6be3923a
work_keys_str_mv AT maitiniyazibake developmentofgypsumplasterboardembodiedwithmicroencapsulatedphasechangematerialforenergyefficientbuildings
AT ashishshukla developmentofgypsumplasterboardembodiedwithmicroencapsulatedphasechangematerialforenergyefficientbuildings
AT shuliliu developmentofgypsumplasterboardembodiedwithmicroencapsulatedphasechangematerialforenergyefficientbuildings
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