Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions

Despite increasing use of in vivo multielectrode array (MEA) implants for basic research and medical applications, the critical structural interfaces formed between the implants and the brain parenchyma, remain elusive. Prevailing view assumes that formation of multicellular inflammatory encapsulati...

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Autores principales:	Aviv Sharon, Nava Shmoel, Hadas Erez, Maciej M. Jankowski, Yael Friedmann, Micha E. Spira
Formato:	article
Lenguaje:	EN
Publicado:	Frontiers Media S.A. 2021
Materias:	neural-engineering neuroelectronics neuroimplant interfacing microelectrodes ultrastructure (electron microscopy) Neurosciences. Biological psychiatry. Neuropsychiatry RC321-571
Acceso en línea:	https://doaj.org/article/599368f3243b4ab285e588ef4deeb0f2
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spelling	oai:doaj.org-article:599368f3243b4ab285e588ef4deeb0f22021-11-22T05:08:20ZUltrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions1662-453X10.3389/fnins.2021.764448https://doaj.org/article/599368f3243b4ab285e588ef4deeb0f22021-11-01T00:00:00Zhttps://www.frontiersin.org/articles/10.3389/fnins.2021.764448/fullhttps://doaj.org/toc/1662-453XDespite increasing use of in vivo multielectrode array (MEA) implants for basic research and medical applications, the critical structural interfaces formed between the implants and the brain parenchyma, remain elusive. Prevailing view assumes that formation of multicellular inflammatory encapsulating-scar around the implants [the foreign body response (FBR)] degrades the implant electrophysiological functions. Using gold mushroom shaped microelectrodes (gMμEs) based perforated polyimide MEA platforms (PPMPs) that in contrast to standard probes can be thin sectioned along with the interfacing parenchyma; we examined here for the first time the interfaces formed between brains parenchyma and implanted 3D vertical microelectrode platforms at the ultrastructural level. Our study demonstrates remarkable regenerative processes including neuritogenesis, axon myelination, synapse formation and capillaries regrowth in contact and around the implant. In parallel, we document that individual microglia adhere tightly and engulf the gMμEs. Modeling of the formed microglia-electrode junctions suggest that this configuration suffice to account for the low and deteriorating recording qualities of in vivo MEA implants. These observations help define the anticipated hurdles to adapting the advantageous 3D in vitro vertical-electrode technologies to in vivo settings, and suggest that improving the recording qualities and durability of planar or 3D in vivo electrode implants will require developing approaches to eliminate the insulating microglia junctions.Aviv SharonAviv SharonNava ShmoelNava ShmoelHadas ErezHadas ErezMaciej M. JankowskiMaciej M. JankowskiYael FriedmannMicha E. SpiraMicha E. SpiraMicha E. SpiraFrontiers Media S.A.articleneural-engineeringneuroelectronicsneuroimplantinterfacingmicroelectrodesultrastructure (electron microscopy)Neurosciences. Biological psychiatry. NeuropsychiatryRC321-571ENFrontiers in Neuroscience, Vol 15 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	neural-engineering neuroelectronics neuroimplant interfacing microelectrodes ultrastructure (electron microscopy) Neurosciences. Biological psychiatry. Neuropsychiatry RC321-571
spellingShingle	neural-engineering neuroelectronics neuroimplant interfacing microelectrodes ultrastructure (electron microscopy) Neurosciences. Biological psychiatry. Neuropsychiatry RC321-571 Aviv Sharon Aviv Sharon Nava Shmoel Nava Shmoel Hadas Erez Hadas Erez Maciej M. Jankowski Maciej M. Jankowski Yael Friedmann Micha E. Spira Micha E. Spira Micha E. Spira Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
description	Despite increasing use of in vivo multielectrode array (MEA) implants for basic research and medical applications, the critical structural interfaces formed between the implants and the brain parenchyma, remain elusive. Prevailing view assumes that formation of multicellular inflammatory encapsulating-scar around the implants [the foreign body response (FBR)] degrades the implant electrophysiological functions. Using gold mushroom shaped microelectrodes (gMμEs) based perforated polyimide MEA platforms (PPMPs) that in contrast to standard probes can be thin sectioned along with the interfacing parenchyma; we examined here for the first time the interfaces formed between brains parenchyma and implanted 3D vertical microelectrode platforms at the ultrastructural level. Our study demonstrates remarkable regenerative processes including neuritogenesis, axon myelination, synapse formation and capillaries regrowth in contact and around the implant. In parallel, we document that individual microglia adhere tightly and engulf the gMμEs. Modeling of the formed microglia-electrode junctions suggest that this configuration suffice to account for the low and deteriorating recording qualities of in vivo MEA implants. These observations help define the anticipated hurdles to adapting the advantageous 3D in vitro vertical-electrode technologies to in vivo settings, and suggest that improving the recording qualities and durability of planar or 3D in vivo electrode implants will require developing approaches to eliminate the insulating microglia junctions.
format	article
author	Aviv Sharon Aviv Sharon Nava Shmoel Nava Shmoel Hadas Erez Hadas Erez Maciej M. Jankowski Maciej M. Jankowski Yael Friedmann Micha E. Spira Micha E. Spira Micha E. Spira
author_facet	Aviv Sharon Aviv Sharon Nava Shmoel Nava Shmoel Hadas Erez Hadas Erez Maciej M. Jankowski Maciej M. Jankowski Yael Friedmann Micha E. Spira Micha E. Spira Micha E. Spira
author_sort	Aviv Sharon
title	Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
title_short	Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
title_full	Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
title_fullStr	Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
title_full_unstemmed	Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions
title_sort	ultrastructural analysis of neuroimplant-parenchyma interfaces uncover remarkable neuroregeneration along-with barriers that limit the implant electrophysiological functions
publisher	Frontiers Media S.A.
publishDate	2021
url	https://doaj.org/article/599368f3243b4ab285e588ef4deeb0f2
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Ultrastructural Analysis of Neuroimplant-Parenchyma Interfaces Uncover Remarkable Neuroregeneration Along-With Barriers That Limit the Implant Electrophysiological Functions

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