High-performance flexible metal-on-silicon thermocouple

Abstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally meas...

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Autores principales:	Daniel Assumpcao, Shailabh Kumar, Vinayak Narasimhan, Jongho Lee, Hyuck Choo
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Thin Film Thermocouples Seebeck Coefficient Temporal Resolution Sensors Costly Fabrication Processes Silicone Arm Medicine R Science Q
Acceso en línea:	https://doaj.org/article/59acb722d00946438107eb419e997b0a
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spelling	oai:doaj.org-article:59acb722d00946438107eb419e997b0a2021-12-02T15:08:03ZHigh-performance flexible metal-on-silicon thermocouple10.1038/s41598-018-32169-92045-2322https://doaj.org/article/59acb722d00946438107eb419e997b0a2018-09-01T00:00:00Zhttps://doi.org/10.1038/s41598-018-32169-9https://doaj.org/toc/2045-2322Abstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally measured Seebeck coefficient of our thermocouple was 9.17 × 10−4 V/°K, which is 30 times larger than those reported for standard metal thin-film thermocouples and comparable to the values of alloy-based thin-film thermocouples that require sophisticated and costly fabrication processes. The temperature-voltage measurements between 20 to 80 °C were highly linear with a linearity coefficient of 1, and the experimentally demonstrated temperature-sensing resolution was 0.01 °K which could be further improved up to a theoretical limit of 0.00055 °K. Finally, we applied this approach to demonstrate a flexible metal-on-silicon thermocouple with enhanced thermal sensitivity. The outstanding performance of our thermocouple combined with an extremely thin profile, bending flexibility, and simple, highly-compatible fabrication will proliferate its use in diverse applications such as micro-/nanoscale biometrics, energy management, and nanoscale thermography.Daniel AssumpcaoShailabh KumarVinayak NarasimhanJongho LeeHyuck ChooNature PortfolioarticleThin Film ThermocouplesSeebeck CoefficientTemporal Resolution SensorsCostly Fabrication ProcessesSilicone ArmMedicineRScienceQENScientific Reports, Vol 8, Iss 1, Pp 1-10 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Thin Film Thermocouples Seebeck Coefficient Temporal Resolution Sensors Costly Fabrication Processes Silicone Arm Medicine R Science Q
spellingShingle	Thin Film Thermocouples Seebeck Coefficient Temporal Resolution Sensors Costly Fabrication Processes Silicone Arm Medicine R Science Q Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo High-performance flexible metal-on-silicon thermocouple
description	Abstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally measured Seebeck coefficient of our thermocouple was 9.17 × 10−4 V/°K, which is 30 times larger than those reported for standard metal thin-film thermocouples and comparable to the values of alloy-based thin-film thermocouples that require sophisticated and costly fabrication processes. The temperature-voltage measurements between 20 to 80 °C were highly linear with a linearity coefficient of 1, and the experimentally demonstrated temperature-sensing resolution was 0.01 °K which could be further improved up to a theoretical limit of 0.00055 °K. Finally, we applied this approach to demonstrate a flexible metal-on-silicon thermocouple with enhanced thermal sensitivity. The outstanding performance of our thermocouple combined with an extremely thin profile, bending flexibility, and simple, highly-compatible fabrication will proliferate its use in diverse applications such as micro-/nanoscale biometrics, energy management, and nanoscale thermography.
format	article
author	Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo
author_facet	Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo
author_sort	Daniel Assumpcao
title	High-performance flexible metal-on-silicon thermocouple
title_short	High-performance flexible metal-on-silicon thermocouple
title_full	High-performance flexible metal-on-silicon thermocouple
title_fullStr	High-performance flexible metal-on-silicon thermocouple
title_full_unstemmed	High-performance flexible metal-on-silicon thermocouple
title_sort	high-performance flexible metal-on-silicon thermocouple
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/59acb722d00946438107eb419e997b0a
work_keys_str_mv	AT danielassumpcao highperformanceflexiblemetalonsiliconthermocouple AT shailabhkumar highperformanceflexiblemetalonsiliconthermocouple AT vinayaknarasimhan highperformanceflexiblemetalonsiliconthermocouple AT jongholee highperformanceflexiblemetalonsiliconthermocouple AT hyuckchoo highperformanceflexiblemetalonsiliconthermocouple
_version_	1718388252556132352

High-performance flexible metal-on-silicon thermocouple

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